Tantalum Chip Capacitors
Standard / HighCap
Series/Type:
Date:
B45196E, B45198E,
B45196H, B45198H
July 2006
© KEMET 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without KEMET's prior express consent is prohibited.
Tantalum chip capacitors
Standard / HighCap
Construction
Polar tantalum capacitors with solid
electrolyte
Conventional TaMnO
2
technology
Flame-retardant plastic case (UL 94 V-0)
Optionally tinned or gold-plated terminals
Features
B45196E, B45198E, B45196H, B45198H
Ultra-high volumetric efficiency
Excellent solderability
Stable temperature and frequency characteristics
Low leakage current, low dissipation factor
Low self-inductance
High resistance to shock and vibration
Suitable for use without series resistor
(special operating conditions recommended)
Lead-free and material content compatible with RoHS
Some partnumbers are only available in M (±20%) tolerance; these types have a maximum
capacitance drift at +125
°C
of +20%
Applications
Telecommunications (e.g. mobile phones, infrastructure)
Data processing (e.g. laptops, mainframes)
Measuring and control engineering (e.g. voltage regulators)
Automotive electronics (e.g. safety applications e.g airbags, ABS, motor management)
Medical engineering
DC/DC converters
Soldering
Suitable for reflow soldering (IR and vapor phase, in compliance with JEDEC J-STD-020 C) and
wave soldering
Delivery mode
Taped and reeled in accordance with IEC 60286-3
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 2 of 20
Tantalum chip capacitors
Standard / HighCap
Dimensional drawing
B45196E, B45198E, B45196H, B45198H
Encapsulation: molded epoxy resin
NiFe; tinned surface Sn100 or gold-plated
Reduced slot length for case size A
Dimensions
Case size
KEMET
EIA/IECQ
A
3216-18
Dimensions in mm (inches)
L
3.2
±0.2
(.126
±0.008)
3.5
±0.2
(.138
±0.008)
6.0
±0.3
(.236
±0.012)
7.3
±0.3
(.287
±0.012)
7.3
±0.3
(.287
±0.012)
W
1.6
±0.2
(.063
±0.008)
2.8
±0.2
(.110
±0.008)
3.2
±0.3
(.126
±0.012)
4.3
±0.3
(.169
±0.012)
4.3
±0.3
(.169
±0.012)
H
1.6
±0.2
(.063
±0.008)
1.9
±0.2
(.075
±0.008)
2.5
±0.3
(.098
±0.012)
2.8
±0.3
(.110
±0.012)
4.1
±0.3
(.161
±0.012)
L
2
typ. W
2
±0.1
H
2
typ. P
±0.3
±(.004)
±(.012)
3.2
1.2
1.3
0.8
(.126) (.047)
(.051) (.031)
3.5
2.2
(.138) (.087)
6.1
2.2
(.240) (.087)
7.3
2.4
(.287) (.094)
7.3
2.4
(.287) (.094)
1.4
0.7
(.055) (.027)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
B
3528-21
C
6032-28
D
7343-31
E
7343-44
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 3 of 20
Tantalum chip capacitors
Standard / HighCap
Marking
Case size A
B45196E, B45198E, B45196H, B45198H
Case size B
Case sizes C, D, E
Voltage coding for case size A
Rated voltage
Code letter
4
G
6.3 10
J
A
16
C
20
D
25
E
35
V
50
T
Capacitance coding
1st and 2nd digit
3rd digit
Capacitance in pF
Multiplier:
6 = 10
6
pF
7 = 10
7
pF
8 = 10
8
pF
Date coding
Year
S = 2004
T = 2005
U = 2006
V = 2007
W = 2008
X = 2009
Month
1 = January
2 = February
3 = March
4 = April
5 = May
6 = June
7 = July
8 = August
9 = September
O = October
N = November
D = December
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 4 of 20
Tantalum chip capacitors
Standard / HighCap
B45196E, B45198E, B45196H, B45198H
Specifications and characteristics for Standard series in brief
Series
Ordering code
Technology
Terminals
Rated voltage
Rated capacitance
Capacitance tolerance
Maximum impedance
Operating temperature range
Failure rate
(1 fit = 1 10
-9
failures/h)
C
R
V
R
≤
330
µF
V
C
R
V
R
> 330
µF
V
Service life
Leakage current
Detail specification
Climatic category
(to IEC 60068-1)
( 55
°C/+125 °C/56
days damp heat test)
(at 40
°C; ≤
V
R
,
R
S
≥
3
Ω/V)
≤3
≤10
(V
R
, 5 min, 20
°C)
I
leak
>500000
10
CECC 30801-801
55/125/56
h
nA/µC
(20
°C,
100 kHz)
Z
max
T
op
(up to 85
°C)
(20
°C,
120 Hz)
V
R
C
R
Standard
B45196E
Ta-MnO
2
Tinned
4 ... 50
0.10 ... 100
±20%, ±10%
0.8 ... 28
55 ... +125
Ω
°C
fit
B45198E
Ta-MnO
2
Gold-plated
VDC
µF
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 5 of 20
Embedded System
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