PRODUCT SPECIFICATION
1.0 SCOPE
This Product Specification covers the 2.54 mm (.100 inch) centerline (pitch) 0.64 mm (.025) square
pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated
with 22 to 28 AWG wire using crimp technology.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBERS
Crimp Terminals: 2759, 41572, 6459
Crimp Housings: 2695
PCB Connectors: 4455
Headers: 4030, 4094, 6373, 7478, 42225, 42226, 42227, 42228, 42375, 42376, 42377, 42624.
Other products conforming to this specification are noted on the individual drawings.
2.2 DIMENSIONS, MATERIALS, PLATINGS AND MARKINGS
Terminal Material: Brass or Phos. Bronze (for Max performance use phos. bronze material.)
Housing: Nylon or Polyester
Pins: Brass or Phos. Bronze
For more information on dimensions, materials, and plating see the individual drawings.
2.3
SAFETY AGENCY APPROVALS
UL File Number @@.. E29179
CSA @@@@@@@....LR19980
Agency Voltage
Rating (AC RMS
or DC)
UL
CSA
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
-
250
Agency Current
Rating (Single
Circuit) (Amps)
UL
CSA
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
-
2.5
Agency
Temperature
Rating (°C)
UL
105°C
105°C
105°C
105°C
105°C
105°C
105°C
105°C
105°C
105°C
120°C
120°C
120°C
105°C
SERIES
2695
4455
4030
4094
6373
7478
42225
42226
42227
42228
42375
42376
42377
42624
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2014-1506
DATE:
12/6/2013
TITLE:
Q
PRODUCT SPECIFICATION
.100 CENTER KK CONNECTORS
CHECKED BY:
SHEET No.
1
of
6
FSMITH
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
PS-10-07
MKIPPER
JBELL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
None
4.0 RATINGS
4.1 VOLTAGE
250 Volts
4.2 CURRENT AND APPLICABLE WIRES
(Current is dependent on connector size, contact
material, plating, ambient temperature, printed circuit board characteristics and related factors.
Actual current rating is application dependent and should be evaluated for each application.)
AWG
22
24
26
28
Amps (Max)
4.00
3.75
3.50
3.00
Outside Insulation Diameter
See Drawings
See Drawings
See Drawings
See Drawings
Note: current ratings are for a single circuit, based on not exceeding 30°C temperature rise.
4.3 TEMPERATURE
Operating Temperature
Non-Operating Temperature
*including terminal temperature rise.
**parts not mated
Brass Terminals
-40°C to +80°C*
-40°C to +105°C**
Phos Bronze Terminals
-40°C to +105°C*
-40°C to +105°C
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2014-1506
DATE:
12/6/2013
TITLE:
Q
PRODUCT SPECIFICATION
.100 CENTER KK CONNECTORS
CHECKED BY:
SHEET No.
2
of
6
FSMITH
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
PS-10-07
MKIPPER
JBELL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION
5.0 PERFORMANCE
5.1 ELECTRICAL REQUIREMENTS
DESCRIPTION
Contact
Resistance
(Low Level)
Contact
Resistance of
Wire Termination
(Low Level)
Insulation
Resistance
Dielectric
Withstanding
Voltage
Capacitance
TEST CONDITION
Mate connectors: apply a maximum voltage
of 20 mV and a current of 100 mA.
Terminate the applicable wire to the terminal
and measure wire using a voltage of 20 mV
and a current of 100 mA.
Unmate & unmount connectors: apply a
voltage of 500 VDC between adjacent
terminals and between terminals to ground.
Unmate connectors: apply a voltage of {two
times the rated voltage plus 1000 volts} VAC
for 1 minute between adjacent terminals and
between terminals to ground.
Measure between adjacent terminals at 1
MHz.
Mate connectors: measure the temperature
rise at the rated current after:
1) 96 hours (steady state)
2) 240 hours (45 minutes ON and 15
minutes OFF per hour)
3) 96 hours (steady state)
REQUIREMENT
10 milliohms
MAXIMUM
[initial]
2 milliohms
MAXIMUM
[initial]
1000 Megohms
MINIMUM
No breakdown
2 picofarads
MAXIMUM
Temperature
Rise
(via Current Cycling)
Temperature rise:
+30°C MAXIMUM
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2014-1506
DATE:
12/6/2013
TITLE:
Q
PRODUCT SPECIFICATION
.100 CENTER KK CONNECTORS
CHECKED BY:
SHEET No.
3
of
6
FSMITH
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
PS-10-07
MKIPPER
JBELL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION
5.2 MECHANICAL REQUIREMENTS
DESCRIPTION
Connector Mate
and
Unmate Forces
TEST CONDITION
Per circuit when mated to an .025 Sq. pin
header without friction lock.
Mate and unmate connector (male to female)
at a rate of 25 ± 6 mm (1 ± ¼ inch) per
minute.
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm (1 ± ¼ inch)
per minute. (Forces will change with platings
and materials.)
Apply an axial insertion force on the terminal
at a rate of 25 ± 6 mm (1 ± ¼ inch) per
minute. (Forces will change with platings and
materials.)
Mate connectors up to 25 cycles at a
maximum rate of 10 cycles per minute prior
to Environmental Tests.
Mate connectors and vibrate per EIA 364-28,
test condition
VII.
Mate connectors and shock at 50 g's with ½
sine wave (11 milliseconds) shocks in the
±X, ±Y,±Z axes (18 shocks total).
Apply an axial pullout force on the wire at a
rate of 25 ± 6 mm (1 ± ¼ inch) per minute.
(For maximum performance use Molex
application tooling with stranded tinned
copper wire)
Apply a perpendicular force.
REQUIREMENT
4.9 N (1.1 lbf)
MAXIMUM insertion force
&
0.56 N (0.125 lbf)
MINIMUM withdrawal force
17.8 N (4.0 lbf)
MINIMUM withdrawal force
Terminal
Retention Force
(in Housing)
Terminal
Insertion Force
(into Housing)
11.12 N (2.5 lbf)
MAXIMUM insertion force
Durability
10 milliohms MAXIMUM
(change from initial)
10 milliohms MAXIMUM
(change from initial) &
Discontinuity < 1 microsecond
10 milliohms MAXIMUM
(change from initial]) &
Discontinuity < 1 microsecond
Wire pullout force depends on
crimp tooling. See relevant
Molex Application Tooling
Specification for requirements.
2.94 N (300 grams) average
Maximum Average
Number
Insertion Insertion
of kinked
force
force
pins
(per pin) (per pin)
Vibration
(Random)
Shock
(Mechanical)
Wire
Pullout Force
(Axial)
Normal
Force
Kinked PC Pin
Insertion Force
(into PCB Hole)
Apply an axial insertion force on pins at a
rate of 25 ± 6 mm (1 ± ¼ inch) per minute.
2
4
6
44.0 N
(9.9 lbf)
21.4 N
(4.8 lbf)
18.2 N
(4.1 lbf)
15.1N
(3.4 lbf)
9.8 N
(2.2 lbf)
4.9 N
(1.1 lbf)
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2014-1506
DATE:
12/6/2013
TITLE:
Q
PRODUCT SPECIFICATION
.100 CENTER KK CONNECTORS
CHECKED BY:
SHEET No.
4
of
6
FSMITH
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
PS-10-07
MKIPPER
JBELL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
PRODUCT SPECIFICATION
5.3 ENVIRONMENTAL REQUIREMENTS
DESCRIPTION
TEST CONDITION
Mate connectors; expose to 5 cycles of:
Temperature °C
Duration (Minutes)
-40 +0/-3
30
+25 ±10
5 MAXIMUM
+105 +3/-0
30
+25 ±10
5 MAXIMUM
Mate connectors; expose to:
96 hours at 105 ± 2°C
REQUIREMENT
10 milliohms MAXIMUM
(change from initial)
&
Visual: No Damage
10 milliohms MAXIMUM
(change from initial])
&
Visual: No Damage
10 milliohms MAXIMUM
(change from initial)
&
Dielectric Withstanding
Voltage:
No Breakdown at 500 VAC
&
Insulation Resistance:
1000 Megohms MINIMUM
&
Visual: No Damage
10 milliohms MAXIMUM
(change from initial)
&
Dielectric Withstanding
Voltage:
No Breakdown at 500 VAC
&
Insulation Resistance:
1000 Megohms MINIMUM
&
Visual: No Damage
Solder coverage:
95% MINIMUM (per
SMES-152)
Shock
(Thermal)
Thermal Aging
Humidity
(Steady State)
Mate connectors: expose to a temperature of
40 ± 2°C with a relative humidity of 90-95%
for 96 hours.
Note: Remove surface moisture and air dry
for 1 hour prior to measurements.
Humidity
(Cyclic)
Mate connectors: cycle per EIA-364-31: 24
cycles at temperature 25 ± 3°C at 80 ± 5%
relative humidity and 65 ± 3°C at 50 ± 5%
relative humidity; dwell time of 1.0 hour;
ramp time of 0.5 hours.
{Note: Remove surface moisture and air dry
for 1 hour prior to measurements.}
Solderability
Per SMES-152
REVISION:
ECR/ECN INFORMATION:
EC No:
UCP2014-1506
DATE:
12/6/2013
TITLE:
Q
PRODUCT SPECIFICATION
.100 CENTER KK CONNECTORS
CHECKED BY:
SHEET No.
5
of
6
FSMITH
DOCUMENT NUMBER:
CREATED / REVISED BY:
APPROVED BY:
PS-10-07
MKIPPER
JBELL
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Microcontroller MCU
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