F-218
SHF–110–01–L–D–RA
ESHF–125–01–L–D–SM–LC
EHF–108–01–F–D–SM–LC
ESHF–105–01–L–D–SM
(1,27 mm) .050"
(1.27
EHF–125–01–L–D–SM–LC
SHF, ESHF, EHF, ECF SERIES
SHROUDED & EJECTOR IDC HEADER
SHF, ESHF Mates with:
FFSD, FFTP (SHF)
EHF Mates with:
FFSD*, FFTP
TYPE
STRIP
1
NO. PINS
PER ROW
01
PLATING
OPTION
D
TAIL
STYLE
OTHER
OPTION
SPECIFICATIONS
For complete specifications
see www.samtec.com?SHF,
www.samtec.com?ESHF or
www.samtec.com?EHF
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Yes
= Mates with
FFSD without
Strain Relief
SHF
04, 05, 06, 08,
10, 11, 12, 13,
15, 17, 20, 25
(Standard sizes)
A
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
TYPE
STRIP
A
No. of pins x
(6.35) .250
–L
= Through-
hole
–TH
–RA
= Mates with
FFSD with
Strain Relief
ESHF
= Right-
angle
(1.27)
.050 TYP
02 04
SHF
(1.27) .050 +
ESHF
(1.27) .050 +
No. of pins x
(10.16) .400
= Surface
Mount
–SM
= Locking
Clip
(Not available
with –RA)
(Manual
placement
required)
–LC
= Tape &
Reel
Packaging
(2.15)
.085
–TR
–K
01 03
–TH
(5.33)
.210
(1.91)
.075
(0.41) .016 SQ
–RA
–SM
(5.46)
.215
(5.85) .230
–SM
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max
(1.27)
.050
= (6.50 mm)
.256" DIA
Polyimide
Film Pick &
Place Pad
(–SM only)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–TH
–RA
(1.27)
.050
EHF
1
NO. PINS
PER ROW
01
PLATING
OPTION
D
TAIL
OPTION
Leave blank
for Through-
Hole version
OTHER
OPTION
ALSO AVAILABLE
(MOQ Required)
• Other sizes
Contact Samtec.
04, 05, 08, 10,
13, 17, 20, 25
(Standard sizes)
(Locks FFSD cable to EHF header)
(8.76)
.345
EJECTOR HEADER CAP
= Gold flash on post,
Matte Tin on tail
–F
–L
= Surface
Mount
–SM
= Polarized Position
(–RA not available)
–“XX”
–LC
No. of positions x (1.27) .050 + (14.48) .570
02
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
= Right-angle
–RA
= Locking Clip
(–SM only)
(Manual placement
required)
(9.65)
.380
No. of positions x (1.27) .050
+ (18.03) .710
ECF
NO. PINS PER ROW
05, 08, 10,
13, 17, 20, 25
(1.27)
.050
01
(3.05)
.120
(8.51)
.335
= (7.50 mm) .295" DIA
Polyimide Film Pick
& Place Pad
–K
–P
–SM
–RA
–TH
(7.52) .296
–SM
(0.41)
.016 SQ
(1.52)
.060
*Important Note:
EHF will not mate to FFSD
with strain relief (-SR option),
see ESHF series.
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
(11.30)
.445
(8.26)
.325
= Pick & Place Pad
(–SM only)
(6.67)
(2.29)
.263
.090
(2.72)
.107
(1.27)
.050
= Tape & Reel
Packaging
(–LC not available)
(1.27) .050
–RA
–TR
–LC
–TH
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
