WBDDQSC-B-07-8201-G-C datasheet, PDF

WBDDQSC-B-07-8201-G-C: DescriptionArray/Network Resistor, Bussed, 0.05W, 8200ohm, 100V, 2% +/-Tol, -25,25ppm/Cel, 1109,; CategoryPassive components The resistor; File Size273KB，4 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

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WBDDQSC-B-07-8201-G-C Overview

Array/Network Resistor, Bussed, 0.05W, 8200ohm, 100V, 2% +/-Tol, -25,25ppm/Cel, 1109,

Parameter Name	Attribute value
Objectid	803219458
Reach Compliance Code	compliant
ECCN code	EAR99
structure	Chip
Network Type	Bussed
Number of terminals	24
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package height	0.406 mm
Package length	2.921 mm
Package form	SMT
Package width	2.184 mm
method of packing	Tray
Rated power dissipation(P)	0.05 W
Guideline	MIL-PRF-38534
resistance	8200 Ω
Resistor type	ARRAY/NETWORK RESISTOR
series	WBC-NETWORK
size code	1109
Temperature Coefficient	25 ppm/°C
Tolerance	2%
Operating Voltage	100 V

Wire Bondable

Resistor Network Arrays

Chip Network Array Series

Absolute tolerances to ±0.1%

Tight TCR tracking to ±5ppm/°C

Ratio match tolerances to ±0.05%

Ultra-stable tantalum nitride resistors

IRC’s TaNSil

network array resistors are ideally suited for applications that demand a small footprint. The small wire

bondable chip package provides higher component density, lower resistor cost and high reliability.

The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost.

Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil

resistor film.

For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC

network array die.

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General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

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