EEWORLDEEWORLDEEWORLD

Part Number

Search

S2010CPG5832D30

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 58300ohm, 150V, 0.5% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size122KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

S2010CPG5832D30 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 58300ohm, 150V, 0.5% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT

S2010CPG5832D30 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1618121093
package instructionCHIP, ROHS COMPLIANT
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.8
JESD-609 codee4
Manufacturer's serial number2010
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
method of packingBULK
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance58300 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage150 V
2010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
48.4°C/W
1000 mW
150 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.200 - .210)
.094 (.093 - .100)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.71
0.51
0.48
4.17
(5.08 - 5.33)
(2.36 - 2.54)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08
C6000 Cache
1. Why do we need Cache?The access speed of large-capacity memory (such as DRAM) is limited, and is generally much slower than the CPU clock speed; small-capacity memory (such as SRAM) can provide fas...
Jacktang Microcontroller MCU
wince 6.0 sd card driver sleep wakeup
Now the sleep-wake process of the SD card driver of wince6.0 simulates the process of pulling out and inserting an SD card. That is to say, when the sleep button is pressed, the SD card is in the card...
lyylsc Embedded System
[Repost] Tmall Genie X1 Disassembly
[align=left]Although I still use Bluetooth speakers, I have always had a heart for smart speakers. Since Amazon released the smart speaker echo a few years ago, I have been drooling over this type of ...
赵玉田 Making friends through disassembly
Serial port problem under wince! Please help me
Under ce4.2, serial ports 1 and 2 are both working, but serial port 3 can only send but not receive, and serial port 4 fails to open. Can anyone help me analyze the possible problem? I have added a st...
pala3cecili Embedded System
The process of WEBENCH design + low-pass filter design under the guidance of WEBENCH (2)
[i=s]This post was last edited by Diguapatch on 2014-8-18 18:22[/i]TI's webench online design tool has a special set of design processes and methods for filter design. This post briefly introduces the...
地瓜patch Analogue and Mixed Signal
How do I control the display and closing of the taskbar in Ce4.2 system?
I have come across some all-in-one computers using ce4.2. Some of them have the taskbar completely locked. When running explorer, the taskbar does not appear. Some of them appear but are always hidden...
madcow Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 617  455  467  1177  2917  13  10  24  59  27 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号