Multilayer Ceramic Chip Capacitors
FEATURES
• HIGH Q FOR RF APPLICATIONS
• STABLE NPO CHARACTERISTICS OVER TEMPERATURE AND VOLTAGE
• LOW LOSS COPPER (Cu) ELECTRODES
• HIGH VOLTAGE (UP TO 500VDC)
• EIA 0201, 0402, 0505, 0603, 0805 AND 1111 CASE SIZES
• IDEAL FOR WIRELESS DATA AND VOICE COMMUNICATIONS APPLICATIONS
WLANs, HIPERLAN, 802.11A, 802.11B, Wi-Fi, BLUETOOTH,TELEMATICS, PCS,
LMDS AND CELLULAR
SPECIFICATIONS
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltage
Q Factor
(1MHz, 1.0Vrms, +25°C)
insulation Resistance
Dielectric Withstanding Voltage
NPO
0.1pF ~ 1000pF
±0.05pF(A), ±0.1pF(B), ±0.25pF(C), ±0.5pF(D)
±1%(F), ±2%(G), ±5% (J)
-55°C ~ +125°C
0 ± 30PPM/°C
6.3Vdc, 10Vdc, 25Vdc, 50Vdc, 100Vdc, 250Vdc & 500Vdc
0201
C < 30pF Q > 400+20xC
0402 (25V ~ 50V)
C > 30pF Q > 1000
0402 (100V ~ 200V)
C < 30pF Q > 800+20xC
0603, 0505, 0805 & 1111
C > 30pF Q > 1400
10,000 Megohms min. @ +25°C
NMC-Q Series
RoHS
Compliant
Includes all homogeneous materials
*See Part Number System for Details
0201 ~ 0805: <100V x 2.5RV, >200V
x 2RV for 1 ~ 5 sec.
1111: <100V
x 2.5RV, <500V x 2RV, 500V x 1.5 for 1 ~ 5 sec.
Note: Reflow soldering allowed for all case sizes. Contact NIC for wave soldering restrictions.
DIMENSIONS (mm)
EIA Case Size
Length (L)
Width (W)
Thickness (T)
Termination Width (P)
0201
0.6 ± 0.03
0.3 ± 0.03
0.33 max.
0.10 ~ 0.20
0402
1.0 ±0.05
0.5 ± 0.05
0.55 max.
0.15 ~ 0.30
0505
1.40 +0.38/-0.25
1.40 ±0.38
1.30 max.
0.12 ~ 0.50
0603
1.6 ±0.10
0.8 ± 0.10
0.87 max.
0.25 ~ 0.55
0805
2.0 ± 0.20
1.25 ± 0.20
0.70 max. (0.2pF)
0.95 max.
0.30 ~ 0.70
1111
2.79 +0.51/-0.25
2.79 ±0.38
1.78 max.
0.13 ~ 0.63
W
T
P
L
100% Sn over Ni barrier
P
PART NUMBER SYSTEM
NMC-Q 0603 NPO 100 J 50 TRP F
Series
RoHS Compliant
TRP = Punched carrier, TRPLP = Embossed Plastic
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros, “R” indicates
decimal for under 10pF
Temperature Characteristic
Size Code (see chart)
1
NIC COMPONENTS CORP.
www.niccomp.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
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