Cal-Chip
O
UTLINE
Electronics, Incorporated
CNTC S
ERIES
Chip Type NTC Thermistors
• Cal-Chip’s CNTC thermistor is made from metallic oxide
ceramic semi-conductor.
• The thermistor is a resistant element having higher sen-
sitivity and reliability. The resistance changes according to
temperature.
• Their leadless chip design makes them ideal for automated
mounting on printed circuit boards.
P
RODUCT
I
DENTIFICATION
CNTC S1 S
103 K 440 H 5Q
Operating
Temperature
B constant tolerance symbol
(H - ±3%)
F
EATURES
• Guaranteed up to 125°C.
• Large B constant for higher temperature measurement
capability.
• Ideal for automatic mounting in bulk or from tapes
because of front-rear symmetry.
• EIAJ standard dimensions.
• Reliability has been improved by use of internal electrodes.
B constant
R
25
tolerance symbol
J = ±5%
K = ±10%
M = ±20%
Resistance of R
25
Packaging
External dimension
(S1: 1608 Type)
Type
S
HAPES
AND
D
IMENSIONS
C
HARACTERISTICS
R25
Resistance of the thermistor at
the temperature of 25±0.2°C and
one digit characteristic section.
For example: 15 kΩ = 153.
Calculated from the resistance of
the thermistor R(T1) and R(T2)
measured at the temperature of
T
1
[K] and T
2
[K] with the following
formula; and the first three digits
out of 4 are used.
In [R (T
1
) / R (T
2
) ]
I
T
1
I
T
2
Dimensions in mm
B constant
TYPE
CNTC1608
L
1.6±0.2
W
0.8±0.2
T
0.8±0.2
e
0.35±0.25
Terminal Electrodes:
Solder Plating
B=
P
ACKAGING
Q
UANTITY
Symbol
S
R
Raraks
Bulk Products
Taped Products
Standard Qty.
2000
4000
Usually, T
1
=298.15K (25°C) and T
2
=358.15K (85°C) are applied.
98
Cal-Chip
I
TEM
Operating Temperature Range
Storage Temperature Range
Rated Power
Nominal Zero-Power Resistance
Electronics, Incorporated
S
PECIFIED
V
ALUE
-55°C to 125°C
-55°C to 125°C
63m W
0.047 to 150kΩ
±5%
±10%
±20%
2950 to 4750K
Within ±3%
Ambient temperature: 25±0.2°C
Measuring electric power: 0.1mW max
CNTC S
ERIES
T
EST
M
ETHODS
AND
Chip Type CNTC Thermistors
R
ELIABILITY
D
ATA
R
EMARKS
Nominal B Constant
Measure the resistance at the ambient temperatures of 25±0.2°C and 85±0.2°C
lnR25-lnR85
T : Absolute temperature
B=
1/T25-1/T85
TO : 273.15
This represents the amount of electric power required to raise the temperature of the
element by 1°C through self heating under thermal equilibrium.
This represents the amount of time for the temperature of the thermistor element to
change by 63.2% of the difference between the initial temperature and the ambient tem-
perature by the drastic change of power application into thermistor from non-zero-power to
zero-power status.
This represents the maximum ambient temperature at which rated power could be applied.
Dissipation Constant (single unit)
1.0 to 2.5mW/°C
Thermal Time Constant (single unit)
Within 5 seconds
Rated Ambient Temperature
Electric Power Derating Curve
25°C
As shown in the figure at right
This represents the relations between the ambient temperature and the maximum
permissible power.
Resistance to Flexure of Substrate
R25 change: within ±5%
B constant change: within ±2%
Warp: 2mm
Testing board: glass-epoxy-resin substrate
Board thickness: 0.8mm
Pressing speed: 0.5mm/sec.
Duration: 30 Sec.
Adhesion of Terminal Electrode
R25 change: within ±5%
B constant change: within ±2%
Applied force: 5N
Duration: 10 sec.
Solderability
At least 80% of terminal electrode is covered by new solder
According to JIS C5102 clause 8.4
Solder Temperature: 230±5°C
Duration: 4±1 sec.
Reflow soldering
Solder Temperature: 240°C
Duration: 5 sec.
Number of reflows: 3 times
Conditions for 1 cycle /
Resistance to Soldering
R25 change: within ±5%
B constant change: within ±2%
Preheating Temperature: 150°C
Preheating Time: 90 sec.
Thermal Shock
R25 change: within ±5%
B constant change: within ±3%
Step 1: -55±2°C
Step 2: Room temp.
Step 3: +125±2°C
Step 4: Room Temp.
30 min.
15 min.
30 min.
15 min.
Number of cycles: 100
Recovery: 2 hrs of recovery under the standard condition after the test
High Temperature Life Test
R25 change: within ±5%
B constant change: within ±3%
Temperature: 125±2°C
Duration: 1000 ±12 hrs
Recovery: 2 hrs of recovery under the standard condition after the removal from the
test chamber
Temperature: 85±2°C
Humidity: 90 to 95%RH
Duration: 1000 ±12 hrs
Recovery: 2 hrs of recovery under the standard condition after the removal from the
test chamber
Damp Heat (steady state)
R25 change: within ±5%
B constant change: within ±3%
Note on standard condition:
“standard condition” referred to herein is defined as follows: 5 to 35°C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air
pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2°C of temper-
ature, 65 to 70% relative humidity and 86 to 106kPa of air pressure.
100
Unless otherwise specified, all the tests are conducted under the “standard condition”.
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