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WBC-B0202CRGG-05-2004-J

Description
Fixed Resistor, Thin Film, 0.25W, 2000000ohm, 100V, 5% +/-Tol, -100,100ppm/Cel, 0202
CategoryPassive components    The resistor   
File Size372KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Environmental Compliance
Download Datasheet Parametric View All

WBC-B0202CRGG-05-2004-J Overview

Fixed Resistor, Thin Film, 0.25W, 2000000ohm, 100V, 5% +/-Tol, -100,100ppm/Cel, 0202

WBC-B0202CRGG-05-2004-J Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1176023894
Reach Compliance Codecompliant
ECCN codeEAR99
structureChip
JESD-609 codee3
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package length0.508 mm
Package formSMT
Package width0.508 mm
method of packingTray
Rated power dissipation(P)0.25 W
GuidelineMIL-PRF-38534
resistance2000000 Ω
Resistor typeFIXED RESISTOR
size code0202
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Tolerance5%
Operating Voltage100 V
Wire Bondable
High Range Chip Resistors
WBC-CR Series
New CHROMAXX
TM
film system
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC Advanced Film Division
IRC’s WBC-CR series now brings higher ohmic range thin film
capabilities to hybrid applications. Using IRC’s new CHROMAXX
TM
film system on silicon substrates provides thin film performance on an extremely small footprint. Custom
resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
R
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
Passivation
to ±0.1%
to ±100ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Gold available)
Gold
3KÅ minimum
Silicon Dioxide or
Silicon Nitride
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
R
Top contact
pad chamfered
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
Backside
½R
½R
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
A subsidiary of
TT electronics plc
WBC-CR Series Issue April 2006
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com
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