EEWORLDEEWORLDEEWORLD

Part Number

Search

BD105-13G-2-0250-0460-0450-ND

Description
Board Connector
CategoryThe connector    The connector   
File Size348KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BD105-13G-2-0250-0460-0450-ND Overview

Board Connector

BD105-13G-2-0250-0460-0450-ND Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid2089464641
Reach Compliance Codecompliant
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (10)
Contact completed and terminatedTIN OVER NICKEL
Contact materialCOPPER ALLOY
JESD-609 codee3
Manufacturer's serial numberBD105
1
2
3
4
5
6
7
8
Global Connector Technology Ltd. - BD105: 1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW, SURFACE MOUNT, VERTICAL
A
A
B
C
D
E
SPECIFICATIONS
规格:
CURRENT RATING
电流额定值:
1 AMP
No. of Contacts
INSULATOR RESISTANCE
绝缘电阻值:
1000 MEGOHMS MIN.
03 to 33
F
DIELECTRIC WITHSTANDING
耐电压:
AC 300 V
Contact Plating
CONTACT RESISTANCE
接触电阻值:
20m
Max.
A = Gold Flash All Over
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
B = Selective Gold Flash Contact Area/
CONTACT MATERIAL
端子物料:
COPPER ALLOY
Tin On Tail
INSULATOR MATERIAL
绝缘½物料
:
C = Tin All Over
STANDARD
标准物料
: POLYESTER
聚酯
, LCP, UL 94-V0
G = 10µ" Gold Contact Area/Tin On Tail
OPTIONS
可选物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94-V0
I = 30µ" Gold Contact Area/Tin On Tail
SOLDERING PROCESS
可焊性
:
Standard = Gold Flash All Over
LCP (STANDARD
标准物料
) -
G
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 250°C for 5-10 sec
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
NYLON 6T (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
: 230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BD074
BD075
BD080
BD090
H
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
28/12/07
PN
STANDARD INSULATOR
MATERIAL & PACKING
OPTIONS CHANGED
CB
PACKING OPTIONS SOLDER TEMP & MATES
WITH INFO. UPDATED
CHANGED
B
27/04/09
1
C
20/05/09
G CE
N N
I
D E
N SC
E E
P L
O
S
B
GC
O
Ordering Grid
B
C
D
E
BD105
XX X
X
XXXX
XXXX
XXXX
X
X
Type
1 = R1 Type
2 = R2 Type
Packing Options
B = Tape and Reel with Cap (Standard)
D = Tube (Standard - where height exceeds 25mm)
E = Tube with Cap
Insulator Material
L = LCP (Standard)
N = Nylon 6T
F
Dimension C (1/100mm)
(Post Height)
Standard - 3.00mm = 0300
or specify Dimension C
e.g. 2.50mm = 0250
Tol +/- 0.2mm
Dimension D (1/100mm)
(Stack Height)
Standard - 4.60mm = 0460
Please Specify Dimension D
e.g. 2.5mm = 0250
Tol +/- 0.2mm
Part Number:-
Dimension E (1/100mm)
(Footprint Width)
Standard - 4.50mm = 0450
or specify Dimension E
e.g. 2.50mm = 0250
Tol +/- 0.2mm
G
Tolerances
(Except as noted)
Date:-
Dimensions in mm
BD105
28 DEC 07
AE
2
D
27/07/09
AE
DIMENSION
AMMENDED
E
27/08/09
3
AJO
BD105
X PCN
X
15/05/14
X.°±5°
.X°±2°
X.X ± 0.20
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
X. ± 0.30
Third Angle Projection
Description:-
H
Sheet No.
1/1
1.27mm PITCH ELEVATED PIN HEADER, SINGLE ROW
SURFACE MOUNT, VERTICAL
www.globalconnectortechnology.com
Material
Drawn by
LYH
X
See Note
E & OE
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Scale
NTS
Revision
4
5
6
7
8
Q: Under what version is the STM32 program made by IAR debugged?
Question: Under what version was the STM32 program made by IAR debugged? I saw that the approximate time was December 2007. I would like to ask what version it was at that time? Now there is only vers...
大漠之洲 stm32/stm8
K40 development board cannot connect to computer
I am using the MDK compilation environment and the kinetis K40 development board. I don't know if it is a driver problem or something else. I would like some advice from an expert....
cuimeng1987 NXP MCU
RF Study Club is now online! Start learning RF here!
[p=26, null, center][url=https://www.eeworld.com.cn/zt/Qorvo/#xinX][font=微软雅黑][size=3][/size][/font][/url][/p][p=26, null, left][font=微软雅黑][size=3] [/size][/font][/p][p=26, null, left][font=微软雅黑][size...
eric_wang RF/Wirelessly
[Project source code] Ubuntu 18.04 uses static IP
This article and design code were written by FPGA enthusiast Xiao Meige. Without the author's permission, this article is only allowed to be copied and reproduced on online forums, and the original au...
小梅哥 ARM Technology
100 points (I can only get 100 points at most), please help me recover the data from the mobile hard drive!
My E901 mobile hard disk was originally in NTFS file format, but I accidentally formatted it to ext3 file format! I tried finaldata and easyrecovery but they both failed to recover it because the ext3...
rebor03 Embedded System
Modulesim - Altera simulation problem
The simulation settings and testbench writing are done according to the data , but there is no response when calling up modulessim-altera simulation. The lower left corner shows VSIM (paused), and the...
eeleader FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 287  1206  2211  2735  966  6  25  45  56  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号