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CFY25-17

Description
GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization)
CategoryDiscrete semiconductor    The transistor   
File Size136KB,6 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
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CFY25-17 Overview

GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization)

CFY25-17 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSIEMENS
package instructionDISK BUTTON, O-CRDB-F4
Contacts4
Reach Compliance Codeunknow
ECCN codeEAR99
ConfigurationSINGLE
Minimum drain-source breakdown voltage5 V
Maximum drain current (Abs) (ID)0.08 A
Maximum drain current (ID)0.08 A
FET technologyJUNCTION
highest frequency bandX BAND
JESD-30 codeO-CRDB-F4
JESD-609 codee0
Number of components1
Number of terminals4
Operating modeDEPLETION MODE
Maximum operating temperature150 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeROUND
Package formDISK BUTTON
Polarity/channel typeN-CHANNEL
Maximum power consumption environment0.25 W
Minimum power gain (Gp)9.5 dB
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal locationRADIAL
Transistor component materialsGALLIUM ARSENIDE
GaAs FET
q
q
q
q
q
CFY 25
Low noise
High gain
For front-end amplifiers
lon-implanted planar structure
All gold metallization
ESD: Electrostatic discharge
sensitive device, observe handling precautions!
Type
CFY 25-17
CFY 25-20
CFY 25-23
Marking
C5
C6
C7
Ordering Code
(tape and reel)
Q62703-F106
Q62703-F107
Q62703-F108
Pin Configuration
1
2
3
4
D
S
G
S
Package
1)
Micro-X
Maximum Ratings
Parameter
Drain-source voltage
Drain-gate voltage
Gate-source voltage
Drain current
Total power dissipation,
T
S
56 ˚C
2)
Channel temperature
Storage temperature range
Thermal Resistance
Channel - soldering point
2)
R
th chS
375
K/W
Symbol
V
DS
V
DG
V
GS
I
D
P
tot
T
ch
T
stg
Values
5
7
–5…+0
80
250
150
– 65 … + 150
mA
mW
˚C
Unit
V
1)
2)
For detailed information see chapter Package Outlines.
T
S
is measured on the source lead at the soldering point to the pcb.
Semiconductor Group
1
07.94

CFY25-17 Related Products

CFY25-17 Q62703-F108 Q62703-F107 Q62703-F106 CFY25 CFY25-20 CFY25-23
Description GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization) GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization) GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization) GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization) GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization) GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization) GaAs FET (Low noise High gain For front-end amplifiers lon-implanted planar structure All gold metallization)

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