ABRACON Crystal Specification for
Micrel Semiconductor MICRF Series RF Transceiver
ABRACON P/N for MICRF Chip
ABLS-6.7458MHz-20-R60-D
ABLS-13.560MHz-10-R20-D
ABLS-4.897MHz-20-R70-D
ABLS-9.84375MHz-10-R20-D
ABLS-9.7941MHz-10-R20
ABLS-13.94916MHz-10-R20
ABLS-12.1875MHz-10-R20
ABLS-13.0625MHz-10-R20
ABLS-13.6050MHz-20-R50-D
ABLS-13.94916MHz-10-R20-D
ABLS-14.3359MHz-20-R50
ABM9-16.000MHz-10-D-1-U
ABM3B-12.1875MHz-10-D4
ABM3B-13.0625MHz-10-D4
For use with Micrel Chip P/N
MICRF011-002-007
MICRF102
MICRF011-002-007
MICRF102
MICRF009-010
MICRF009-010
MICRF112
MICRF112
MICRF505
MICRF009-010
MICRF505
MICRF505-509
MICRF112
MICRF112
PROPRIETARY NOTICE
These documents, and the contained information herein,
are proprietary and are not to be reproduced, used or
disclosed to others for manufacture or for any other
purpose, except as specifically authorized, in writing, by
ABRACON Corporation.
WARNING: ESD SENSITIVE PRODUCT
ABRACON CORPORATION
Headquarters
30332 Esperanza, Rancho Santa Margarita
California, The USA.
Tel : 949-546-8000
Fax: 949-546-8001
ABRACON
CORPORATION
The Power Of Linking Together
PREP.
YH
CKD
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DATE
8/27/2012
DATE
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ENGR.
SR
APP'D
CP
DATE
8/27/2012
DATE
8/27/2012
ABRACON Crystal Specification for
Micrel Semiconductor MICRF Series RF Transceiver
DRAWING NO.
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REV.
None
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TITLE
ABRACON
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1.0 SCOPE
This specification describes specifications of ABRACON's crystals for Micrel Semiconductor's IC's.
2.0 ELECTRICAL SPECIFICATIONS
2.1 Individual Specifications
ABRACON P/N
ABLS-6.7458MHz-20-R60-D
ABLS-13.560MHz-10-R20-D
ABLS-4.897MHz-20-R70-D
ABLS-9.84375MHz-10-R20-D
ABLS-9.7941MHz-10-R20
ABLS-13.94916MHz-10-R20
ABLS-12.1875MHz-10-R20
ABLS-13.0625MHz-10-R20
ABLS-13.6050MHz-20-R50-D
ABLS-13.94916MHz-10-R20-D
ABLS-14.3359MHz-20-R50
ABM9-16.000Mhz-10-D-1-U
ABM3B-12.1875MHz-10-D4
ABM3B-13.0625MHz-10-D4
Frequency
(MHz)
6.74580
13.56000
4.89700
9.84375
9.79410
13.94916
12.18750
13.06250
13.60500
13.94916
14.33590
16.00000
12.18750
13.06250
Load
Cap. (pF)
20
10
20
10
10
10
10
10
20
10
20
10
10
10
Operating
Temp. ( C)
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
-40 to +85
-40 to +85
0 to +70
-40 to +85
-40 to +85
-40 to +85
Storage
ESR
Temp. ( C) (ohms)
-40 to +85
60
-40 to +85
20
-40 to +85
70
-40 to +85
20
-40 to +85
20
-40 to +85
20
-40 to +85
20
-40 to +85
20
-40 to +85
50
-40 to +85
20
-40 to +85
50
-40 to +105
80
-40 to +85
70
-40 to +85
70
Frequency
Temperature
Tolerance (ppm)
Stability (ppm)
±50
±50
±50
±50
±50
±50
±50
±50
±50
±50
±50
±10
±30
±30
±50
±50
±50
±50
±50
±50
±50
±50
±50
±50
±50
±20
±50
±50
Note: Over temperature specification for Part# ABM9-16.000MHz-10-D-1-U revised from ±10 ppm to ±20 ppm (-40ºC to +85ºC) on 08/27/2012.
2.2 Common Specifications
Shunt capacitance C0:
Operation mode:
Drive level:
Aging @ 25° C per a year :
Insulation resistance:
Spurious responses:
3.0 SPECIAL REQUIREMENT
This product is RoHS compliant and Pb free.
7 pF max.
AT-cut Fundamantal
1 mW max., 100μW Typical (ABLS)
100 uW max., 10μW Typical (AM9 and
± 5 ppm max.
500 M min. at 100Vdc ± 15V
-3dB max.
ABRACON
CORPORATION
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4.0 MARKING
Marking Method : Laser Marking
4.1 ABLS Series
Frequency (MHz)
ex. 160 for 16.00 MHz
A
4.2 ABM9 Series
ZYX
Traceability Code (Internal)
Year : e.g. 7 for 2007 (See table below)
Month : A to L (See table below)
XXX
A ZYX
Frequency (MHz)
ex. 080 for 8.00 MHz
Traceability Code (Internal)
Year : e.g. 7 for 2007 (See table below)
Month : A to L (See table below)
ABRACON's "A"
4.3 ABM3B Series
XX.XXX
A ZYX
4.2.1 Marking Method : Laser Marking
Date Code
Month
January
February
March
April
May
June
July
August
September
October
November
December
Frequency (MHz)
ex. 13.062 for 13.0625 MHz
Traceability Code (Internal)
Year : e.g. 7 for 2007 (See table below)
Month : A to L (See table below)
ABRACON's "A"
Code
A
B
C
D
E
F
G
H
I
J
K
L
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5.0 OUTLINE DIMENSIONS
5.1 ABLS Series
5.2 ABM9 Series
5.3 ABM3B Series
Chamfer on PIN 4
(See note)
Note: Due to the availability of raw materials,
this part may be manufactured with the chamfer
on pin 4. Be advised that this does not affect
the electrical characteristics of the crystal in
any way.
Chamfer on PIN 1
(Default)
Dimension : mm
TOLERANCES:
UNLESS OTHERWISE SPECIFIED:
.X: ± 0.1 (0.25)
.XX: ± 0.01 (0.025)
.XXX: ± 0.005 (0.013)
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CORPORATION
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6.0 RELIABILITY TEST
No.
1
2
3
4
5
6
7
8
9
Test Items
Temperature Cycling:
Test Conditions
The component shall remain within the electrical specification (± 5 pp
max) after 3 cycles of high and low temperature testing (-40°C to
+85°C) for 2 hours max.
The component shall remain within the electrical specification after
exposure at extreme temperature -40°C to +85°C for 5 minutes for 3
cycles.
The component shall remain within the electrical specification after
loaded vibration at 10Hz to 55Hz, amplitude 1.5mm, within 1 minute
for 2 hours minimum on each axis (X,Y,Z).
The component shall remain within the electrical specifications after a
natural drop (3X) on a hard wooden board at 75 cm.
The component shall remain within the electrical specifications after
being kept at a condition of ambient temperature +85°C, 85% RH for
96 hours minimum.
Expose samples to 60PSIG Helium gas for 2 hours.
Max leak rate 2X10-8atmcc/s.
Submerge samples in 100% De-ionized water or Perfluorocarbon at
85°C for at least 1 minute. Check for bubbles.
Solderability of terminals shall be kept at more than 95% after dipped
in solder flux at 260°C ± 5°C for 5 seconds.
The component shall withstand maximum bend of 90°C
reference to base for 2 bends. Solder tinning must be
4 microns thick minimum.
Thermal Shock:
Vibration:
Drop Test:
Humidity:
Fine Leak Test:
Gross Leak Test:
Solderability:
Lead Bend:
(ABLS only)
6.1 REFLOW PROFILE
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