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240-118ABH-22

Description
heatsink TO-220 vert twist fin
CategoryThermal management products    Heat resisting bracing   
File Size917KB,20 Pages
ManufacturerWakefield-Vette
Websitehttp://www.wakefield-vette.com/
Download Datasheet Parametric View All

240-118ABH-22 Overview

heatsink TO-220 vert twist fin

240-118ABH-22 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWakefield-Vette
Reach Compliance Codecompli
Main materialALUMINUM
colorBLACK
structureCLIP
fin directionANGLED
Surface layerANODIZED
high30 mm
length25.4 mm
contourU
Heat Resistant Support Device TypeHEAT SINK
width12.7 mm
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a
variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,
increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with tin-lead plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
20
250
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
217-36CT6
.390 (9.9)
217-36CTT6
.390 (9.9)
217-36CTR6
.390 (9.9)
Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
DDPAK DEVICE
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY:
í
Device only, NC
v
Device + HS, NC
Device + HS, 100 lfm
„
Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
TAPE DETAILS
REEL DETAILS
Dimensions: in.
All other products, please contact factory for price, delivery, and minimums.
30
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