EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342L08B1B26UWP

Description
Fixed Resistor, Thin Film, 0.8W, 1260ohm, 150V, 0.1% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size96KB,5 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

M55342L08B1B26UWP Overview

Fixed Resistor, Thin Film, 0.8W, 1260ohm, 150V, 0.1% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP

M55342L08B1B26UWP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid145087005338
package instructionSMT, 2010
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.3
Other featuresNON-INDUCTIVE
structureRectangular
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.8382 mm
Package length5.3086 mm
Package formSMT
Package width2.4892 mm
method of packingWaffle Pack
Rated power dissipation(P)0.8 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance1260 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyTHIN FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage150 V
E/H (Military M/D55342)
www.vishay.com
Vishay Dale Thin Film
QPL MIL-PRF-55342 Qualified
Thin Film Resistor, Surface-Mount Chip
FEATURES
• Established reliability, “S” and “V” failure rate level
(10 ppm), C = 2
• High purity alumina substrate
• Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+150 °C operating conditions
LINKS TO ADDITIONAL RESOURCES
• Very low noise and voltage coefficient
(< -25 dB, 0.5 ppm/V)
• Non-inductive
• Laser-trimmed tolerances ± 0.1 %
• Wraparound resistance less than 0.010
Ω
typical
• In-lot tracking less than 5 ppm/°C
• Complete MIL-testing available in-house
• Antistatic waffle pack or tape and reel packaging available
• Military / aerospace / QPL
D
D
3
3
3D Models
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing.
CONSTRUCTION
Passivation
Resistor Film
Solder
Coating
Nickel Barrier
High Purity
Alumina Substrate
Adhesion Layer
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability: Absolute
SPECIFICATIONS
Tamelox resistor film (passivated nichrome)
10
Ω
to 6.19 MΩ
± 25 ppm/°C to ± 300 ppm/°C
± 0.1 %, ± 0.25 %, ± 0.5 %, ± 1 %,
± 2 %, 5 %, ± 10 %
ΔR
± 0.02 %
-
0.1 ppm/V
30 V to 200 V
-65 °C to +150 °C
-65 °C to +150 °C
< - 25 dB
ΔR
± 0.01 %
CONDITIONS
-
-
-55 °C to +125 °C
+25 °C
2000 h at +70 °C
-
-
-
-
-
-
1 year at +25 °C
Revision: 15-Nov-2021
Document Number: 60018
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
4 charts showing how and when the chip shortage will end
Source: https://spectrum.ieee.org/chip-shortageFabs using older process nodes are keyHistorians may spend decades analyzing the consequences of the COVID-19 pandemic. But the chip shortage it caused w...
dcexpert Talking
AD19 only shows wireframe after copper is laid, which does not look like laid copper
Dear friends, why does my AD19 only show the wireframe after copper laying, but not the laid copper, as shown in the picture? Is there any setting? Switch to AD10 and open it, double-click the copper ...
AshleyZhai PCB Design
The DLL entry DLLMain is called twice by the system using DLL_PROCESS_DETACH
Under CE5, I wrote a USB driver for Motola mobile phone. Now it loads OK. The information from the serial port is as follows: USBInstallDriver++ load USBD.DLL sucess! USBInstallDriver-- DLL_PROCESS_DE...
hsdzcf Embedded System
I now have the stm32f103 minimum system ban and the ov7670 camera with FIFO. If I want the minimum system version to use...
I now have a stm32f103 minimum system board and an ov7670 camera with FIFO. If I want to use the ov7670 camera with the minimum system board, can I not connect the pins directly? Do I need to make a d...
LOVELESS燚 stm32/stm8
STEP Model
[i=s]This post was last edited by paulhyde on 2014-9-15 04:02[/i] Are you still using the built-in component library of Altium Designer? Or a self-built library? Are you worried about the lack of Step...
philips_lu Electronics Design Contest
How to convert a string of uchar data into hexadecimal numbers and send it?
I originally planned to send 7E 01 01 00 01 01 04 0D. The original program was: Call: SendString_PH_START("7E 01 01 00 01 01 04 0D"); Definition: void SendString_PH_START(uchar *ptr) { for(int j=0;j<2...
面纱如雾 Microcontroller MCU

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 773  2413  1006  2441  1818  16  49  21  50  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号