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DPZ128X32IV3-20M

Description
Flash Module, 128KX32, 200ns, CERAMIC, MODULE, SLCC, PGA-66
Categorystorage    storage   
File Size872KB,14 Pages
ManufacturerB&B Electronics Manufacturing Company
Download Datasheet Parametric View All

DPZ128X32IV3-20M Overview

Flash Module, 128KX32, 200ns, CERAMIC, MODULE, SLCC, PGA-66

DPZ128X32IV3-20M Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerB&B Electronics Manufacturing Company
Parts packaging codePGA
package instructionAPGA, PGA66,11X11
Contacts66
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time200 ns
Spare memory width16
Data pollingNO
JESD-30 codeS-XPGA-P66
JESD-609 codee0
memory density4194304 bit
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of terminals66
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeAPGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY, PIGGYBACK
Parallel/SerialPARALLEL
power supply5 V
Programming voltage12 V
Certification statusNot Qualified
Maximum seat height4.1402 mm
Maximum standby current0.0004 A
Maximum slew rate0.12 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
switch bitNO
typeNOR TYPE
Base Number Matches1
4 Megabit FLASH EEPROM
DPZ128X32IV3
DESCRIPTION:
The DPZ128X32IV3 ‘’VERSA-STACK’’ module is a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC) mounted on a co-fired ceramic substrate. It offers
4 Megabits of FLASH EEPROM in a single package
envelope of 1.090" x 1.090" x .163".
The DPZ128X32IV3 is built with two SLCC packages
each containing two 128K x 8 FLASH memory devices.
Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Versa-Stack’’ family of modules
offers a higher board density of memory than available
with conventional through-hole, surface mount, module
or hybrid techniques.
FEATURES:
Organization:
128K x 32, 256K x 16
Fast Access Times (max.):
120, 150, 170, 200, 250ns
Fully Static Operation
- No clock or refresh required
TTL Compatible Inputs
and Outputs
Common Data Inputs
and Outputs
10,000 Erase/Program
Cycles (min.)
66 - Pin PGA ‘’VERSA-STACK’’
Package
FUNCTIONAL BLOCK DIAGRAM
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
I/O0 - I/O31
CE0, CE1
WE0, WE1
OE
V
PP
V
DD
V
SS
N.C.
Address Inputs
Data Input/Output
Chip Enables
Write Enables
Output Enable
Programming
Voltage (+12.0V)
Power (+5V)
Ground
No Connect
30A072-10
REV. A
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
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