EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-01A-01-C3-R0

Description
heatsink 40x40x10mm xcut t412
CategoryThermal management products   
File Size417KB,1 Pages
ManufacturerAll Sensors
Environmental Compliance  
Download Datasheet Parametric View All

ATS-01A-01-C3-R0 Overview

heatsink 40x40x10mm xcut t412

ATS-01A-01-C3-R0 Parametric

Parameter NameAttribute value
Datasheets
ATS-01A-01-C3-R0
Standard Package1
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeTop Mou
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodPush Pi
ShapeSquare, Fins
Length1.575" (40.01mm)
Width1.575" (40.00mm)
Diamete-
Height Off Base (Height of Fin)0.394" (10.00mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow22.05°C/W @ 100 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlue Anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-01A-01-C3-R0
Description:
pushPIN™ HS ASMBLY,FINE-PITCH,XCUT, HOLE PATTERN:4-CORNER,BLUE,T412
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-FPX040040010-01-C3-R0
Push Pin:
Springs:
ATS-PP-01
ATS-PPS-01
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
22.05
4.02
200
(1.0)
9.75
2.68
300
(1.5)
5.69
2.22
400
(2.0)
4.11
1.97
500
(2.5)
3.35
1.80
600
(3.0)
2.90
1.68
700
(3.5)
2.61
Fin
Pitch
FINE-PITCH
Fin
Type
XCUT
Hole
Pattern
4-CORNER
1.58
Product Detail
P/N
ATS-01A-01-C3-R0
A
40.00
Dimensions
B
C
E
40.00
10.00
33.00
F
33.00
NOTES:
Push Pin
ATS-PP-01
Spring
ATS-PPS-01
TIM
T412
Finish
BLUE ANODIZED
For Illustration Purposes ONLY.
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction
of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice
to improve the design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
【Design Tools】Explain the usage of ISE+timing+constrain+
InConstraints Guide: Quick Start Guide appendix H.InUsing Timing Constraints: Developmental System Reference Guide chapter 6.InTiming Analyzer: Timing Analyzer Reference/User Guide.InTRCE: Development...
sdjntl FPGA/CPLD
[Hot Recommendation] The most popular Valentine's Day gifts in 2009
Valentine's Day 2009 is approaching with brisk steps under the enthusiastic urging of lovers. As Valentine's Day 2009 is approaching, you may be worried about choosing a sweet Valentine's Day gift? It...
onlylovehk Talking
atmel zigbee protocol stack transplantation (zigduino development board)
I am new to zigbee. I am using a zigduino development board with an MCU model of Atmel's Atmega128RFA1. I want to port the zigbee protocol stack to it, but I don't know where to start. I have read the...
sumi123 RF/Wirelessly
The P10_16X32LED dot matrix schematic diagram, which is currently hot-selling on the market, is exclusively released!
The P10_16X32LED dot matrix schematic diagram, which is currently hot on the market, is exclusively released! Due to confidentiality, the manufacturer does not provide the schematic diagram and source...
ylyfxzsxyl MCU
The difference between power factor, apparent power and reactive power
Whether it is LED, fluorescent lamp or incandescent lamp, we need to understand one of the important parameters - power factor (PFC). Let's learn what power factor is. 1. Power factor Power factor rep...
czf0408 LED Zone
Share some good content from deyisupport (with benefits!)
[b][url=http://www.deyisupport.com/blog/b/behindthewheel/archive/2015/05/18/51962.aspx][font=微软雅黑][size=3]A large wave of car head-up displays is approaching[/size][/font][/url][/b] [font=微软雅黑][size=3...
eric_wang TI Technology Forum

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2111  1947  251  1062  2542  43  40  6  22  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号