LD12CA301JAX1A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD12CA301JAX1A

LD12CA301JAX1A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 600V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.0003uF, Surface Mount, 1812, CHIP; CategoryPassive components capacitor; File Size59KB，2 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD12CA301JAX1A Overview

Ceramic Capacitor, Multilayer, Ceramic, 600V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.0003uF, Surface Mount, 1812, CHIP

LD12CA301JAX1A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1852940166
package instruction	, 1812
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	7.5
capacitance	0.0003 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.54 mm
JESD-609 code	e0
length	4.5 mm
Manufacturer's serial number	LD12
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, 7 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	600 V
series	LD(HIGH VOLTAGE)
size code	1812
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	3.2 mm

Preview

Download Datasheet

View All

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Applications

AVX Corporation will support those customers for commercial and military

Multilayer Ceramic Capacitors with a termination consisting of 5% minimum

lead. This termination is indicated by the use of a “B” in the 12th position of the

AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full

range of products to our customers. AVX has provided in the following pages, a

full range of values that we are offering in this “B” termination.

Larger physical sizes than normally encountered chips are used to make high

voltage MLC chip product. Special precautions must be taken in applying these

chips in surface mount assemblies. The temperature gradient during heating or

cooling cycles should not exceed 4ºC per second. The preheat temperature must

be within 50ºC of the peak temperature reached by the ceramic bodies through

the soldering process. Chip sizes 1210 and larger should be reflow soldered only.

Capacitors may require protective surface coating to prevent external arcing.

For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or

SMT configurations (for details see section on high voltage leaded MLC chips).

NEW 630V RANGE

HOW TO ORDER

LD08

271

Capacitance Code

(2 significant digits

+ no. of zeros)

Examples:

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 μF = 105

Capacitance

Tolerance

C0G: J = ±5%

K = ±10%

M = ±20%

X7R: K = ±10%

M = ±20%

Z = +80%, -20%

Voltage

Temperature

AVX

600V/630V = C

Coefficient

Style

1000V = A

C0G = A

LD05 - 0805

1500V = S

X7R = C

LD06 - 1206

2000V = G

LD10 - 1210

2500V = W

LD08 - 1808

3000V = H

LD12 - 1812

4000V = J

LD13 - 1825

5000V = K

LD20 - 2220

LD14 - 2225

LD40 - 3640

***

Test

Termination

Packaging Special Code

Level

B = 5% Min Pb 1 = 7" Reel** A = Standard

A = Standard X = FLEXITERM

3 = 13" Reel

with 5% min. 9 = Bulk

Pb*

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

FLEXITERM is not available in the LD40 Style

The LD40 Style is not available on 7" Reels.

***

AVX offers nonstandard chip sizes. Contact factory for details.

Not RoHS Compliant

DIMENSIONS

SIZE

(L) Length

millimeters (inches)

LD05 (0805)

LD06 (1206)

LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)

2.01 ± 0.20

3.20 ± 0.20

4.57 ± 0.25

4.50 ± 0.30

5.70 ± 0.40

5.72 ± 0.25

9.14 ± 0.25

(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)

(W) Width

1.25 ± 0.20

1.60 ± 0.20

2.50 ± 0.20

2.03 ± 0.25

3.20 ± 0.20

6.40 ± 0.30

5.00 ± 0.40

6.35 ± 0.25

10.2 ± 0.25

(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(T) Thickness

1.30

1.52

1.70

2.03

2.54

3.30

2.54

Max.

(0.051)

(0.060)

(0.067)

(0.080)

(0.100)

(0.130)

(0.100)

(t) terminal min. 0.50 ± 0.25

0.25 (0.010)

0.76 (0.030)

max. (0.020 ± 0.010) 0.75 (0.030)

0.75 (0.030)

1.02 (0.040)

1.52 (0.060)

* Reflow soldering only.

Performance of SMPS capacitors can be simulated by downloading SpiCalci software program -

http://www.avx.com/SpiApps/default.asp#spicalci

Custom values, ratings and configurations are also available.

104

Recommended Resources

Liaohe brand BD-152 refrigerator circuit

Macro YPF5-4 range hood circuit diagram

High performance household inverter power supply

Power carrier interface circuit

Flashlight control model motor circuit

Computer motherboard circuit diagram 820 1_42

Using mmap to copy files: Using mmap to copy files is a kernel operation, but understanding the principle is helpful for further learning. http://blog.chinaunix.net/space.php?uid=20937170do=blogid=2983502...; gongping11 Linux and Android

robot: The control of robots is a typical application of DSP in motors. Let’s first talk about the development of wheeled robots in this area, haha!...; gaoxiao Microcontroller MCU

Hot topic: The four most popular and profitable majors in the 5G era, which you definitely can’t miss in the 2019 college entrance examination!: In 2019, we ushered in the first year of the 5G era. I believe everyone has seen a lot of news about 5G, so what kind of talents are needed for the realization and further widespread application of 5G...; freebsder RF/Wirelessly

Help: wince DLL compilation problem: ] Linking obj\ARMV4I\debug\ecr_ime.dll BUILD: [01:0000000048:ERRORE] ecr_ime.obj : error LNK2019: unresolved external symbol sprintf referenced in function InputDispPYPrompt BUILD: [00:0000000014:PROG...; 轩辕情伤 Embedded System

Project transplantation issues.: I have a PDA application developed by EVC, which is placed in the Test folder. Now I want to open it with .net2003, but when I open the project directly and browse to the Test folder, I cannot see the...; wmin99 Embedded System

【SAM R21】WSNDEMO control individual lights: There are many things worth reading in WSNDEMO, especially the document AVR2130_LWMesh_Developer_Guide_v1.2.1.pdf, which explains DEMO in detail. Relying on this, the host who knows nothing about ZigB...; ljj3166 Microchip MCU

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components