EEWORLDEEWORLDEEWORLD

Part Number

Search

CHFP6KE20

Description
Patented Flip-Chip Series
CategoryDiscrete semiconductor    diode   
File Size154KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

CHFP6KE20 Overview

Patented Flip-Chip Series

CHFP6KE20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeFLIP-CHIP
package instructionR-XUUC-N2
Contacts2
Reach Compliance Codeunknow
ECCN codeEAR99
Minimum breakdown voltage22.2 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-XUUC-N2
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation600 W
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formUNCASED CHIP
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation2.5 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage20 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
Unidirectional and Bidirectional
Fully glass passivated
600 watt (10/1000
µs)
Eliminates wire bonding
NON Inductive Insertion
No voltage overshoot
Patented Flip-Chip Series
MAXIMUM RATINGS
Max Junction Temperature: 150
0
C (with conformal coating)
Storage Temperature: -55
0
C to +150
0
C
Flip-Chip Peak Pulse Power: 600 Watts (10/1000
µs)
Maximum non-repetitive peak power 600 Watts (10/1000
µs)
Total continuous power dissipation 2.5 W (with adequate heat
sink @ 75
0
C)
Turn-on time (theoretical) unidirectional 1X10
-12
Turn-on time (theoretical) bidirectional 1X10
-9
MECHANICAL
Weight: 0.01 grams (approximate)
Solderable standoff tabs .040X.040X.010
Waffle package 50 pices or wafer ring 70 pieces
PACKAGING
BIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
FLIP-CHIP DIMENSIONS
PAD SIZE & CIRCUIT
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL
inches (mm)
FLIP-CHIP DIMENSIONS
PAD SIZE & CIRCUIT
V
BR
above 30 V
V
BR
30V and below
MSC1596.PDF
ISO 9001 CERTIFIED
REV B 3/13/2000

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1991  2184  183  1887  960  41  44  4  38  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号