EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-16B-149-C3-R0

Description
heatsink 35x35x20mm L-tab t412
CategoryThermal management products   
File Size345KB,1 Pages
ManufacturerAll Sensors
Environmental Compliance  
Download Datasheet Parametric View All

ATS-16B-149-C3-R0 Overview

heatsink 35x35x20mm L-tab t412

ATS-16B-149-C3-R0 Parametric

Parameter NameAttribute value
Datasheets
ATS-16B-149-C3-R0
Standard Package1
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeTop Mou
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodPush Pi
ShapeSquare, Fins
Length1.378" (35.00mm)
Width1.378" (35.00mm)
Diamete-
Height Off Base (Height of Fin)0.790" (20.00mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow6.35°C/W @ 100 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlue Anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-16B-149-C3-R0
Description:
pushPIN™ HS ASMBLY,COARSE-PITCH,STRAIGHT, HOLE PATTERN:LEFT-TABBED,BLUE,T412
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-CPX035035020-149-C3-R0
Push Pin:
Springs:
ATS-PP-02
ATS-PPS-16
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
6.35
3.55
200
(1.0)
3.72
2.67
300
(1.5)
3.00
2.29
400
(2.0)
2.62
2.06
500
(2.5)
2.37
1.89
600
(3.0)
2.19
1.77
700
(3.5)
2.05
1.67
Fin
Pitch
COARSE-
PITCH
Fin
Type
STRAIGHT
Hole
Pattern
LEFT-
TABBED
Product Detail
P/N
ATS-16B-149-C3-R0
A
35.00
Dimensions
B
C
E
35.00
20.00
40.00
F
40.00
NOTES:
Push Pin
ATS-PP-02
Spring
ATS-PPS-16
TIM
T412
Finish
BLUE ANODIZED
For Illustration Purposes ONLY.
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction
of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice
to improve the design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
[Ask TI] Is there any book about the detailed internal structure of a microcontroller?
I have just started learning msp430 and can understand ordinary program codes. Now I want to study in depth and understand the principle and structure of the microcontroller, but I have been strugglin...
gpsbird Microcontroller MCU
ADS1115 data sampling problem
I used ADS1115 to sample only 65536, what's going on? (reference voltage 3.3v, voltage base 4.096V, select channel AIN1), this is the configurationchan[0] = 0x90; //write host addresschan[1] = 0x01; /...
jianhong0425 MCU
sd large capacity problem
Has anyone implemented a large-capacity SD card driver that supports 4G? Which files need to be modified when WINCE supports large-capacity SD cards? Thank you....
等待巴蒂 Embedded System
TI Design Competition [Smart Guardian of Modern Garage]
[align=left][font=微软雅黑]This device designs an automatic ventilation control system with an MSP430 Launchpad microcontroller as the control center, and proposes a solution to monitor and adjust the tem...
maylove Microcontroller MCU
How to use PB to register DLL under WINDOWS to CE platform?
I need to call a DLL from an open source package when developing on Pocket PC2003. The LoadLibrary dynamic call always returns NULL. (The path is set correctly, because I can call the system DLL in th...
demingn Embedded System
Power system composed of ceramic stacked supercapacitors
[size=16px] In April 2006, EEStor, a company in Texas that develops energy storage devices for electric vehicles, published a patent for a power system composed of ceramic laminated supercapacitors. O...
zhdphao Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 718  1056  218  1445  1739  15  22  5  30  36 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号