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CHPHT2010L2705JGTD

Description
Fixed Resistor, Thick Film, 0.1W, 27000000ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size110KB,6 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

CHPHT2010L2705JGTD Overview

Fixed Resistor, Thick Film, 0.1W, 27000000ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP

CHPHT2010L2705JGTD Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid145111920832
package instructionCHIP
Reach Compliance Codeunknown
Country Of OriginFrance
ECCN codeEAR99
YTEOL7.8
structureRectangular
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature230 °C
Minimum operating temperature-55 °C
Package height0.5 mm
Package length5.03 mm
Package formSMT
Package width2.64 mm
method of packingTR, PLASTIC
Rated power dissipation(P)0.1 W
resistance27000000 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyTHICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage200 V
CHPHT
www.vishay.com
Vishay Sfernice
High Temperature (245 °C) Thick Film Chip Resistor
FEATURES
• High temperature (245 °C)
• Large ohmic value range 0.1
to 100 M
• Operating temperature range
(-55 °C to +230 °C)
• SMD wraparound chip resistor
• Storage temperature range
(-55 °C to +245 °C)
Available
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
• Gold terminations for HMP process (< 1 μm thick) for
temperature up to 245 °C
• Tin / silver terminations for operating temperature up to
200 °C
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
For applications such as down hole applications or aircraft breaking systems, the need for parts able to withstand very severe
conditions (temperature as high as 230 °C powered or up to 245 °C un-powered) has leaded Vishay Sfernice to push out the
limit of the thick film technology. Designers might read the application note “Power Dissipation Considerations in High Precision
Vishay Sfernice Thin Film Chips Resistors and Arrays (P, PRA etc.) (High Temperature Applications)”
(www.vishay.com/doc?53047) in conjunction with this data sheet to help them to properly design their PCBs and get the best
performances of the CHPHT. Vishay Sfernice R&D engineers will be willing to support any customer design considerations.
DIMENSIONS
in millimeters
D
C
B
E
A
CASE SIZE
0603
0805
1206
2010
A
± 0.152
1.60
1.85
3.00
5.03
B
± 0.127
0.90
1.25
1.73
2.64
C
± 0.127
0.38
0.38
0.38
0.50
D
± 0.127
0.31
0.31
0.40
0.50
E
± 0.127
0.40
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A)
G
min.
X
max.
Z
max.
CASE SIZE
0603
0805
1206
2010
Revision: 24-Jan-18
Z
max.
2.15
2.70
3.85
5.88
G
min.
0.39
0.44
1.59
3.62
X
max.
1.03
1.38
1.85
2.77
Document Number: 52032
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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