CC
S
2300 Series Low Profile Card Edge Connector
.125[3.18] Contact Centers
Specifications
Insulator Material: Glass filled polyester, type PBT,
94 V-O, UL Rated.
Contact Material: Phosphor Bronze Alloy
Contact Plating: Gold and/or Tin over .000050” Nickel,
(See Contact Plating Options).
Current Rating:
3 amp at 30°C
Contact Resistance: Contact to Daughter Card:
10 m
Ω
Insulation Resistance: 5000 M
Ω
Dielectric Withstand Voltage: 1500 V AC
Daughter Board Insertion Force:
16 oz max. per contact pair
when tested with a .071” thick gage.
R
C
R
Recognized under the recognized component
Program of Underwriters Laboratories, Inc.
File Numbers: E146967 and E176234
Daughter Board Withdrawal Force:
1 oz min. per contact pair
when tested with a .054” thick gage.
PLEASE CONTACT ECS FOR DIMENSIONING
POLARIZING KEYS
P/N 23-PK2
.230 [5.84]
KEY IN BETWEEN CONTACTS
(ORDER SEPARATELY)
KEY REPLACES ONE PAIR OF CONTACTS
(ORDER SEPARATELY)
.175 [4.44]
.032 [.81]
.280 [7.11]
.200 [5.08]
.051 [1.30]
5.05 [12.83]
P/N 23-PK1
.103 [2.62]
CONSULT FACTORY FOR MOLDED IN KEY
WWW.ECSCONN.COM
.125[3.18] Contact Centers, Low Profile Card Edge
D
±.005[.13]
B
±.005[.13]
A
F
.125 [3.175] typ.
E
±.015[.38]
C
±.010[.25]
.265 [6.73]
.431 [10.95]
.245 [6.22]
Refer to Termination Type
Dimensions are in inch [mm]
TERMINATION TYPE
Eyelet Accepts 3-#26 AWG
.140 [3.56] Row Spacing
.125 [3.18]
.275 [6.98]
.225 [5.72]
.185 [4.70]
.007 [.18] thick
Overall plated only
.156 [3.96]
Letter B side
.140 [3.56]
.200 [5.08]
5
= Wide Dip Solder
.200 [5.08]
.185 [4.70]
.016 [.41] thick
1
= Eyelet
2
= Eyelet
3
= Right Angle
4
= Narrow Dip Solder
MOUNTING STYLE
0 .125 [3.18]
#4-40
0 .116 [2.95]
Clearance for
#4-40 screw
3
= Floating Bobbin
Ears Removed
.135 [3.43]
1
= Clearance Hole
2
= Threaded Insert
4
= No Mounting Ears
5
= Side Mounting
PART NUMBERING
23 XX
SERIES CODE
.125” [3.18] Contact Centers
XX
DX
XX
XXX
MODIFICATIONS
010
= Card Extender For .062”
[1.58] Thick PCB
NO. CONTACT PAIRS
01
-
60
TERMINATION TYPE
1
= Eyelet (.016 [.41] thick)
2
= Eyelet (.007 [.18] thick)
3
= Right Angle
4
= Narrow Dip Solder
5
= Wide Dip Solder
50µ” Nickel Underplate
PLATING
MATERIALS
Insulator / Contact
1
= Valox / Phosphor Bronze
2
= Valox / Beryllium Copper
3
= Ryton / Phosphor Bronze
CONTACT
10
= 10µ” Au
20
= 15µ” Au
30
= 30µ” Au
40
= 10µ” Au
50
= 15µ” Au
60
= 30µ” Au
MOUNTING STYLE
1
= Clearance Hole
2
= Threaded Insert
3
= Floating Bobbin
4
= No Mounting Ear
5
= Side Mounting
100µ” Sn
100µ” Sn
100µ” Sn
5µ” Au
5µ” Au
5µ” Au
TAIL
CONSULT FACTORY FOR CONNECTORS BUILT TO YOUR SPECIFICATION
WWW.ECSCONN.COM
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
