EEWORLDEEWORLDEEWORLD

Part Number

Search

2319-21-D3-30-010

Description
Card Edge Connector
CategoryThe connector    The connector   
File Size107KB,2 Pages
ManufacturerE Connector Solutions
Download Datasheet Parametric View All

2319-21-D3-30-010 Overview

Card Edge Connector

2319-21-D3-30-010 Parametric

Parameter NameAttribute value
Objectid1971530305
Reach Compliance Codeunknown
ECCN codeEAR99
Connector typeCARD EDGE CONNECTOR
Contact point genderFEMALE
DIN complianceNO
Filter functionNO
IEC complianceNO
MIL complianceNO
Mixed contactsNO
Installation typeCABLE
Number of rows loaded2
OptionsGENERAL PURPOSE
Termination typeSOLDER
Total number of contacts38
UL Flammability Code94V-0
CC
S
2300 Series Low Profile Card Edge Connector
.125[3.18] Contact Centers
Specifications
Insulator Material: Glass filled polyester, type PBT,
94 V-O, UL Rated.
Contact Material: Phosphor Bronze Alloy
Contact Plating: Gold and/or Tin over .000050” Nickel,
(See Contact Plating Options).
Current Rating:
3 amp at 30°C
Contact Resistance: Contact to Daughter Card:
10 m
Insulation Resistance: 5000 M
Dielectric Withstand Voltage: 1500 V AC
Daughter Board Insertion Force:
16 oz max. per contact pair
when tested with a .071” thick gage.
R
C
R
Recognized under the recognized component
Program of Underwriters Laboratories, Inc.
File Numbers: E146967 and E176234
Daughter Board Withdrawal Force:
1 oz min. per contact pair
when tested with a .054” thick gage.
PLEASE CONTACT ECS FOR DIMENSIONING
POLARIZING KEYS
P/N 23-PK2
.230 [5.84]
KEY IN BETWEEN CONTACTS
(ORDER SEPARATELY)
KEY REPLACES ONE PAIR OF CONTACTS
(ORDER SEPARATELY)
.175 [4.44]
.032 [.81]
.280 [7.11]
.200 [5.08]
.051 [1.30]
5.05 [12.83]
P/N 23-PK1
.103 [2.62]
CONSULT FACTORY FOR MOLDED IN KEY
WWW.ECSCONN.COM
RSL10-002GEVB power management node design
In this project, a power management function node is designed, which is equivalent to the function of a smart socket. It can be connected in series at the main power inlet to collect and analyze the p...
dql2016 onsemi and Avnet IoT Innovation Design Competition
To learn DSP, you need to know the DSP startup process!
TI supports many ways of booting, such as internal RAM (SARAM), flash, SCI, SPI, etc. But no matter which booting method is used, it follows the following process. http://img.my.csdn.net/uploads/20121...
fish001 Microcontroller MCU
Problems with evc using ado to connect to the database
In VC6, when developing ADO database programs, the following sentence should be used: #import "c:\program files\common files\system\ado\msado15.dll " no_namespace rename( "EOF ", "adoEOF ") In EVC, an...
zxpgreentea Embedded System
Research on audio conference signal synthesis algorithm based on DSP
[size=4]With the continuous development of digital signal processing (DSP) algorithms and chip processing capabilities as well as the optimization of communication network structure, modern communicat...
Jacktang DSP and ARM Processors
Hercules series development process and ECC function usage learning
Hercules development process 1. Use HALCoGen to generate code according to the set configuration. To use HALCoGen to generate code, please refer to the post in this forum https://bbs.eeworld.com.cn/th...
anvy178 Microcontroller MCU
Ask everyone a strange question!!! About Neumann rounding~~~~~
I didn't pay close attention to it before, but I discovered it by accident today!!!!!!!!!!!!! The book says that no matter whether the discarded bit is 0 or 1, the last bit left should always be 1. I ...
wyy123 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 319  1798  2197  1657  174  7  37  45  34  4 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号