Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
HV-HT Series, High Voltage, High Temperature 200°C, C0G Dielectric, 500 – 2,000 VDC (Industrial Grade)
Packaging C-Spec Ordering Options Table
Termination Finish Options
Packaging Type/Options
Standard Packaging – Unmarked
3
Bulk Bag
Waffle Tray
2
7" Tape & Reel
C = 100% Matte Sn
L = SnPb (5% Pb min.)
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin minimum
13" Reel
7” Tape & Reel/2 mm pitch
4
7" Tape & Reel – 50 pcs
7" Tape & Reel – 100 pcs
7" Tape & Reel – 250 pcs
7" Tape & Reel – 500 pcs
7" Tape & Reel – 1,000 pcs
Blank
1
7292
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
T050
T100
T250
T500
T1K0
7282
7130
Packaging
Ordering Code (C-Spec)
Moisture Sensitive Packaging
5
– Unmarked
3
Waffle Tray
2
7" Tape & Reel
7" Tape & Reel – 50 pcs
7" Tape & Reel – 100 pcs
7" Tape & Reel – 250 pcs
7" Tape & Reel – 500 pcs
7" Tape & Reel – 1,000 pcs
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin minimum
Contact KEMET
6
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain
capacitors that have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 through 2225 case
size devices with chip thickness of ≥ 1.9mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options
may be available. Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 µin min / 11.8 µin max.). Not available for case sizes larger than
2225 (5664 Metric).
6
Additional reeling or packaging options may be available. Contact KEMET for details.
[i=s]This post was last edited by paulhyde on 2014-9-15 03:02[/i] If anyone can figure out the speed please upload it!!!!!!!!!!!!!!!!!!!!!!!! Thank you!!!...
When we set out to create an op amp for a headphone application (we ended up choosing the OPA1622), the first problem we needed to solve was determining how much power the headphone would require. Thi...
Automatic gain AGC circuit, if the analog front end AFE or the OP built into the MCU has this function, then there is no need to worry about OP saturation distortion or not being able to reach full sc...
The board is not complicated, but there are many lines. I drew the PCB directly without a schematic diagram. As shown in the picture, how can Altium Designer check for such missing lines? :congratulat...
Many of these 5G base stations will use massive MIMO antennas. These new 5G network architectures drive always-on connectivity at the edge of the cellular network thanks to massive MIMO antennas. Here...
Today's computer peripherals are pursuing high speed and high versatility. In order to meet user needs, seven companies led by Intel launched the USB (Universal Serial Bus) bus protocol in 1994, wh...[Details]
Remote keyless entry (RKE) systems have become popular with users, with more than 80% of new cars in North America and more than 70% in Europe equipped with RKE systems. In addition to the obvious ...[Details]
No matter which processor you are learning, the first thing you need to understand is the registers and working mode of the processor.
ARM has 37 registers, including 31 general registers and ...[Details]
System design is a complex process. It is not enough to just use ICs. There are many details to consider. This article uses a high-fidelity music playback system as an example to introduce how to s...[Details]
1 Introduction
With the acceleration of the pace of urban modernization, society has higher requirements for urban road lighting and urban lighting projects. The state has clearly required tha...[Details]
The solidification and modularization of intelligent video analysis algorithms are the current trends in the application of intelligent video analysis technology. It perfectly combines intelligent ...[Details]
5. Identifiers and keywords of C language
A complete PIC microcontroller C language program usually consists of six parts: include files (i.e. header files 1, variable definitions, variable de...[Details]
Since the No. 4 blast furnace of Handan Iron and Steel was put into operation in 1993, its external equipment has been seriously aged, and the original PLC control system TDC3000 of the hot blast furn...[Details]
This week, Microsoft held its 2012 Microsoft Worldwide Partner Conference (WPC) in Toronto, Canada. At the conference, Microsoft showed its new products and services to partners around the world. A...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
Abstract: In recent years, with the establishment and grid-connected power generation of a large number of solar photovoltaic power stations at home and abroad, photovoltaic grid-connected inverter...[Details]
System Overview
The system consists of a signal preprocessing circuit, a single-chip computer AT89C2051, a systematic LED display module, a serial port data storage circuit and system software...[Details]
At present, how various communication technologies will evolve after 3G is a focus of great concern in the industry. Especially for TD-SCDMA, whether it can achieve smooth evolution to the next gen...[Details]
1 Introduction
Ultrasound refers to elastic vibration with a frequency higher than the audible frequency limit (i.e., in the frequency band above 20 kHz). The propagation process of this vib...[Details]
In the "digital pressure measurement" experimental device of applied physics, the subject technical knowledge of analog circuits, digital circuits, sensors and single-chip microcomputers is used. In o...[Details]