DPS128X8CA3-30C datasheet, PDF

DPS128X8CA3-30C: DescriptionSRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50; Categorystorage storage; File Size220KB，10 Pages; ManufacturerB&B Electronics Manufacturing Company

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DPS128X8CA3-30C Overview

SRAM Module, 128KX8, 30ns, CMOS, CPGA50, CERAMIC, MODULE, SLCC, PGA-50

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	B&B Electronics Manufacturing Company
Parts packaging code	PGA
package instruction	APGA, PGA50,5X10
Contacts	50
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	30 ns
I/O type	COMMON
JESD-30 code	R-CPGA-P50
JESD-609 code	e0
length	25.146 mm
memory density	1048576 bit
Memory IC Type	SRAM MODULE
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	50
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Output characteristics	3-STATE
Exportable	YES
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	APGA
Encapsulate equivalent code	PGA50,5X10
Package shape	RECTANGULAR
Package form	GRID ARRAY, PIGGYBACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.207 mm
Maximum standby current	0.00025 A
Minimum standby current	2 V
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
width	13.716 mm
Base Number Matches	1

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