performance oscillators utilize a proven silicon MEMS
technology to provide excellent jitter and stability over
a wide range of supply voltages and temperatures. By
eliminating the need for quartz or SAW technology,
MEMS oscillators significantly enhance reliability and
accelerate product development, while meeting
stringent clock performance criteria for a variety of
communications, storage, and networking applications.
DSC1101 has a standby feature that allows it to
completely power-down when EN pin is pulled low;
whereas for DSC1121, only the outputs are disabled
when EN is low. Both oscillators are available in
industry standard packages, including the small
2.5 mm x 2.0 mm, and are “drop-in” replacements for
standard 4-pin CMOS quartz crystal oscillators.
Functional Block Diagram
Applications
• Storage Area Networks
- SATA, SAS, Fibre Channel
• Passive Optical Networks
- EPON, 10G-EPON,V GPON, 10G-PON
• Ethernet
- 1G, 10GBASE-T/KR/LR/SR, and FCoE
• HD/SD/SDI Video and Surveillance
• PCI Express
• Display Port
2017-2020 Microchip Technology Inc.
DS20005613D-page 1
DSC1101/21
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, V
IN
..............................................................................................................................–0.3V to V
DD
+ 0.3V
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
ESD Protection On All Pins ........................................................................................... 4000V HBM, 1500V CDM (max.)
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Note:
1000+ years of data retention on internal memory.
DC CHARACTERISTICS
Electrical Characteristics
Parameters
Supply Voltage (Note
1)
Sym.
V
DD
Min.
2.25
—
Supply Current
I
DD
—
—
Frequency Stability
(Including frequency
variations due to initial
tolerance, temp. and
power supply voltage.)
Aging
Startup Time (Note
2)
Input Logic Levels
Input Logic High
Input Logic Low
Output Disable Time
(Note
3)
Output Enable Time
Enable Pull-up Resistor
(Note
4)
CMOS Output
Output Logic Levels
Output Logic High
Output Logic Low
Note 1:
2:
3:
4:
V
OH
V
OL
0.9
V
DD
—
—
—
—
0.1
V
DD
V
I = ±6 mA
—
Typ.
—
—
20
31
—
—
—
—
—
—
—
—
—
—
40
Max.
3.6
0.095
22
35
±10
±20
—
—
—
—
0.75
V
DD
—
—
—
—
—
±25
±50
±5
5
—
0.25
V
DD
5
5
20
—
V
ns
ms
ns
k
—
—
DSC1101
DSC1121
Pull-up Resistor Exist
ppm
ms
ppm
mA
Units
V
—
DSC1101, EN pin low, output
is disabled
DSC1121, EN pin low, output
is disabled
Output enabled, C
L
= 15 pF,
F
0
= 100 MHz
Ext Comm. & Ind. only
All temp ranges
All temp ranges
All temp ranges
1 year @ 25°C
T = 25°C
Conditions
f
f
t
SU
V
IH
V
IL
t
DS
t
EN
—
Pin 6 V
DD
should be filtered with 0.1 µF capacitor.
t
SU
is time to 100 ppm of output frequency after V
DD
is applied and outputs are enabled.
Output Waveform and Test Circuit figures define the parameters.
Output is enabled if pad is floated or not connected.
DS20005613D-page 2
2017-2020 Microchip Technology Inc.
DSC1101/21
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics
Parameters
Output Transition Time
Rise Time
Fall Time
Sym.
t
R
t
F
Min.
—
—
2.3
Frequency
f
0
3.3
Output Duty Cycle
Period Jitter
Integrated Phase Noise
Note 1:
2:
3:
4:
SYM
J
PER
J
PH
45
—
—
—
—
—
—
3
0.3
0.38
1.7
170
55
—
—
—
2
ps
RMS
%
ps
RMS
Typ.
1.1
1.3
—
Max.
2
2
170
MHz
ns
Units
Conditions
20% to 80%
C
L
= 15 pF
C
L
= 15 pF, –20°C to +70°C
and –40°C to +85°C
C
L
= 15 pF, –40°C to +105°C
and –55°C to +125°C
—
F
OUT
= 125 MHz
200 kHz to 20 MHz @ 125 MHz
100 kHz to 20 MHz @ 125 MHz
12 kHz to 20 MHz @ 125 MHz
Pin 6 V
DD
should be filtered with 0.1 µF capacitor.
t
SU
is time to 100 ppm of output frequency after V
DD
is applied and outputs are enabled.
Output Waveform and Test Circuit figures define the parameters.
Output is enabled if pad is floated or not connected.
2017-2020 Microchip Technology Inc.
DS20005613D-page 3
DSC1101/21
TEMPERATURE SPECIFICATIONS
Parameters
Temperature Ranges (Note
1)
T
A
Operating Temperature Range (T)
T
A
T
A
T
A
Junction Operating Temperature
Storage Temperature Range
Soldering Temperature Range
Note 1:
T
J
T
S
—
–20
–40
–40
–55
—
–55
—
—
—
—
—
—
—
—
+70
+85
+105
+125
+150
+150
+260
°C
°C
°C
°C
°C
°C
°C
Ordering Option E
Ordering Option I
Ordering Option L
Ordering Option M
—
—
40 sec. max
Sym.
Min.
Typ.
Max.
Units
Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
JA
). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005613D-page 4
2017-2020 Microchip Technology Inc.
DSC1101/21
2.0
Note:
NOMINAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
In the UAV flight control system, the flight controller is its core component, which is responsible for the acquisition of flight control system signals, the solution of control laws, the attitude and...
I am using WinCE 4.2. I added the USB mouse driver to Core OS -> Display based devices -> Core OS Services -> USB Host Support -> USB Human Input Device (HID) Class Driver, customized the platform, ge...
[size=4]The difference between TI c6000 and arm data types[/size] [size=4][/size] [size=4] [/size] [size=4]Data types used in ARM systems[/size] [size=4] [/size] [size=4]Data types supported by the AR...
Create a TOOLBAR resource by yourself, and then add the following code to the OnCreate() function in MainFrame: if(!m_newToolBar.CreateEx(this) || !m_newToolBar.LoadToolBar(IDR_TOOLBAR1) ) { TRACE0("F...
NXP i.MX6ULL extends the i.MX6 series. It is a high-performance, ultra-efficient, low-cost processor sub-series that uses the advanced ARM Cortex-A7 core and runs at up to 800MHz. The i.MX6ULL applica...
1. Several nouns
ABI:
The specifications that an executable file must follow in order to run in a specific execution environment;
Separately generated relocatabl...[Details]
From being a global leader to losing the market, Korean battery manufacturers have always wanted to regain the lost market and dignity, but facing Chinese battery manufacturers represented by CAT...[Details]
introduction
Bluetooth technology is a short-range wireless communication technology designed to replace wired cables. It is a wireless communication technology standard developed by the SIG, ...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
Whether it is an electric car or an ordinary fuel car, for the vast majority of car buyers, the final cost of use is what they care about most. For fuel cars, how to save fuel is what drivers care ...[Details]
Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
On August 22, the National Energy Administration released the latest data, showing that by the end of July 2025, China's total number of electric vehicle charging infrastructure will reach 16.696 m...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
Teletrac Navman has launched the Multi IQ dashcam, a cloud-based solution designed for large commercial vehicle operators. It connects up to five cameras to cover the vehicle's interior, sides, and...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
To improve the lateral active safety of intelligent connected vehicles, the identification and definition of unexpected functional safety scenarios for the EPS (Electronic Steering System) ...[Details]
Industrial Control Electronics
京公网安备 11010802033920号
EEWORLD
