5.0 mm x 3.2 mm Package Pinout ............................................................................................................................................... 1
Ordering Information .................................................................................................................................................................... 2
Device Configurations and Pin-outs ............................................................................................................................................. 9
Pin-out Top Views................................................................................................................................................................. 9
Test Circuit Diagrams for LVCMOS and Clipped Sinewave Outputs ......................................................................................... 10
Frequency Stability ............................................................................................................................................................. 16
Output Frequency and Format............................................................................................................................................ 16
Output Frequency Tuning ................................................................................................................................................... 16
Pin 1 Configuration (OE, VC, or NC) .................................................................................................................................. 17
Control Voltage Bandwidth ................................................................................................................................................. 20
Pull Range and Average Pull Range .................................................................................................................................. 22
Output Frequency ............................................................................................................................................................... 23
2
I C Control Registers .......................................................................................................................................................... 25
Serial Interface Configuration Description .......................................................................................................................... 28
Serial Signal Format ........................................................................................................................................................... 28
Parallel Signal Format ........................................................................................................................................................ 29
Parallel Data Format ........................................................................................................................................................... 29
2
I C Timing Specification ...................................................................................................................................................... 31
2
I C Device Address Modes ................................................................................................................................................. 32
Schematic Example ............................................................................................................................................................ 33
Dimensions and Patterns ........................................................................................................................................................... 34
Additional Information ................................................................................................................................................................ 36
Revision History ......................................................................................................................................................................... 37
Rev 1.05
Page 3 of 38
www.sitime.com
SiT5156
1 MHz to 60 MHz, ±0.5 to ±2.5 ppm, Elite Platform™ Super-TCXO
Electrical Characteristics
All Min and Max limits are specified over temperature and rated operating voltage with 15 pF output load unless otherwise
stated. Typical values are at 25°C and 3.3V Vdd.
Table 1. Output Characteristics
Parameters
Nominal Output Frequency Range
Operating Temperature Range
Symbol
F_nom
T_use
Min.
1
-20
-40
-40
Frequency Stability over
Temperature
Initial Tolerance
Supply Voltage Sensitivity
F_stab
–
–
–
F_init
F_Vdd
–
–
–
–
Output Load Sensitivity
F_load
–
–
–
Frequency vs. Temperature Slope
ΔF/ΔT
–
–
–
Dynamic Frequency Change during
Temperature Ramp
One-Year Aging
20-Year Aging
F_dynamic
–
–
–
F_1y
F_20y
–
–
Typ.
–
–
–
–
–
–
–
–
±7.10
±11.83
±28.40
±0.81
±1.35
±3.24
±15
±25
±60
±0.13
±0.21
±0.50
±1
±2
Max.
60
+70
+85
+105
±0.5
±1.0
±2.5
±1
±16.25
±32.50
±65.0
±2.75
±5.50
±11.00
±25
±50
±100
±0.21
±0.42
±0.83
–
–
Unit
MHz
°C
°C
°C
ppm
ppm
ppm
ppm
ppb
ppb
ppb
ppb
ppb
ppb
ppb/°C
ppb/°C
ppb/°C
ppb/s
ppb/s
ppb/s
ppm
ppm
Initial frequency at 25°C at 48 hours after 2 reflows
MCU Training Video Tutorial - Embedded Development Related Technology Videos---------------------------------------------------- Introduction to MCU Video Tutorial This is a revolutionary video tutori...
The LCD is 640*480, and when displaying the WINCE interface, it moves up by about 20 pixels, causing the status bar to not be at the bottom of the LCD. Is this because the frame synchronization is not...
In
circuit design,
current
measurement
is widely used, and the main fields are divided into three categories: in measurement,
the electric meter
is used to measure the curre...[Details]
0 Introduction
With the development of my country's economy, the number of motor vehicles continues to increase. The growth of existing roads and other hardware facilities can no longer meet t...[Details]
Editor's note: In order to help technicians or engineers who have knowledge of PIC microcontroller assembly language quickly master the method of using C language to program PIC microcontrollers, t...[Details]
introduction
MEMS is a high-tech that has flourished on the basis of integrated circuit production technology and dedicated micro-electromechanical processing methods. Pressure sensors develop...[Details]
This article will introduce a design method for a distributed control system used in a tracking car, which can perform distributed control of motor modules, sensor modules, and lighting control mod...[Details]
Key Points
1. Now, in addition to high-end smartphones and tablets, users also expect to use touch screens in other applications, and they are gradually appearing in cars and instruments.
...[Details]
Energy conservation and environmental protection are the main directions of current automotive technology research, and power batteries are the key to electric vehicle technology. Research on powe...[Details]
0 Introduction
In the design and construction of communication systems,
communication power supply
is called the heart of the communication system. The power supply system will dire...[Details]
Some people believe that hybrid vehicles are just a transitional product, and the ultimate goal of developing new energy vehicles is electric vehicles. Therefore, China should skip hybrid vehicles ...[Details]
Since the implementation of the self-weight toll collection system, the highway administration has not only high requirements for the vehicle axle recognition rate, but also requires a long service li...[Details]
1. Introduction
With the continuous development of modern urban construction, infrastructure and real estate are becoming increasingly prosperous, and the quality requirements for construction ...[Details]
1. Introduction
Due to the good programmability and superior performance of FPGA, the number of embedded systems using FPGA chips in LCD splicing screens is increasing rapidly, especially in t...[Details]
introduction
As the application of single-chip microcomputers in various fields becomes more and more extensive, the requirements for their reliability are also getting higher and higher. The ...[Details]
Example of multitasking and resource reuse of programs
There is an electromechanical device with two buttons that control two different parts of the device.
Now the requirement is:
wh...[Details]
1. Project Introduction
Energy consumption is an important controllable part of the cost of enterprise products. Reducing energy consumption is an important way for enterprises to reduce costs...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
