Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0603
Applications
I
Temperature measurement and compensation in
B573**
V 3**
0,8±0,15
0,9 max.
Features
I
Multilayer SMD NTC with inner electrodes
I
Ni barrier termination (Ag/Ni/Sn)
I
High accuracy:
±
5 % in resistance,
Termination
0,35±0,15
– mobile phone applications
(e.g. battery pack, TCXO, LCD)
– data systems
– automotive electronics
1,6±0,15
TNT0396-Y
B
value tolerance down to
±
1,5 % available on request
I
Excellent long-term ageing stability in high-temperature
and high-humidity environment
I
Superior resistance stability during soldering (change < 1 %)
Options
Dimensions in mm
Approx. weight 6 mg
Alternative resistance ratings, resistance tol.
<
5 % and
B
value tol. < 3 % available on request
Delivery mode
Cardboard tape, 180-mm reel, PU: 4000 pcs (standard); 330-mm reel, PU: 16000 pcs (on request)
Climatic category (IEC 60068-1)
Max. power at 25
°
C (on PCB)
Resistance tolerance
Rated temperature
B
value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
R
25
No. of
R/T
characteristic
8501
8501
8501
8501
8501
8502
8502
8502
8502
8502
B
25/50
K
3470
3470
3470
3470
3470
3940
3940
3940
3940
3940
P
25
∆
R
N
/R
N
T
N
∆
B/B
δ
th
1)
τ
c
1)
C
th
1)
1)
55/125/56
180
±
5 %,
±
10 %
25
±
3%
approx. 3,0
approx. 4,0
approx. 12,0
B
25/100
K
3550
3550
3550
3550
3550
4000
4000
4000
4000
4000
mW
°
C
mW/K
s
mJ/K
B
25/85
K
3540
3540
3540
3540
3540
3980
3980
3980
3980
3980
Ordering code
Ω
47
100
150
220
330
470
680
1,0 k
1,5 k
10 k
B57311V2470+060
B57311V2101+060
B57311V2151+060
B57311V2221+060
B57311V2331+060
B57321V2471+060
B57321V2681+060
B57321V2102+060
B57321V2152+060
B57321V2103+060
1) Depends on mounting situation
50
05/02
Temperature Measurement
SMD NTC Thermistors with Nickel Barrier Termination, Size 0603
Reliability data
B573**
V 3**
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
Test conditions
Storage at upper
category temperature
T:
(125
±
2)
°
C
t:
1000 h
Temperature of air: (40
±
2)
°
C
Relative humidity of air:
(93 +2/–3) %
Duration: 56 days
∆
R
25
/R
25
(typical)
<2%
Remarks
Storage in damp
heat, steady state
<2%
Rapid temperature
cycling
Endurance
Lower test temperature: – 55
°
C < 2 %
Upper test temperature: 125
°
C
Number of cycles: 100
P
max
: 180 mW
T:
(65
±
2)
°
C
t:
1000 h
<2%
Solderability
IEC
60068-2-58
JIS C 0054
Solderability:
(215
±
3)
°
C / (3
±
0,3) s
(235
±
5)
°
C / (2
±
0,2) s
Resistance to soldering heat:
(260
±
5)
°
C / (10
±
1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
<1%
52
05/02
Herausgegeben von EPCOS AG
Unternehmenskommunikation, Postfach 80 17 09, 81617 München, DEUTSCHLAND
++49 89 636 09, FAX (0 89) 636-2 26 89
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drückliche Genehmigung der EPCOS AG nicht gestattet.
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Published by EPCOS AG
Corporate Communications, P.O. Box 80 17 09, 81617 Munich, GERMANY
++49 89 636 09, FAX (0 89) 636-2 26 89
EPCOS AG 2002. Reproduction, publication and dissemination of this brochure and the information contained therein without
EPCOS’ prior express consent is prohibited.
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This brochure replaces the previous edition.
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