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FX10A-100P/10-SV1

Description
conn header 100pos W/post smd
CategoryThe connector    The connector   
File Size632KB,20 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
Download Datasheet Parametric View All

FX10A-100P/10-SV1 Overview

conn header 100pos W/post smd

FX10A-100P/10-SV1 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHirose
Reach Compliance Codeunknow
ECCN codeEAR99
Other featuresHIGH DENSITY, 10 GROUND CONTACTS ALSO AVAILABLE
Board mount optionsPOLARIZATION POST
body width0.232 inch
subject depth0.177 inch
body length1.461 inch
Body/casing typeRECEPTACLE
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD
Contact completed and terminatedGOLD
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact resistance60 mΩ
DIN complianceNO
Dielectric withstand voltage150VAC V
Durability50 Cycles
Filter functionNO
IEC complianceNO
Insulation resistance100000000 Ω
Insulator colorBEIGE
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee4
MIL complianceNO
Manufacturer's serial numberFX10
Plug contact pitch0.02 inch
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
PCB contact row spacing5.207 mm
Plating thickness4u inch
polarization keyPOLARIZED HOUSING
Rated current (signal)0.3 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal length
Terminal pitch0.5 mm
Termination typeSURFACE MOUNT
Total number of contacts110
UL Flammability Code94V-0
10
+
Gbps 0.5mm pitch Stacking Connectors
FX10 Series
Electrical Interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH)
sMechanical
Features
q
0.5mm Pitch
q
Stacking Height : 4 ~ 8mm
q
Number of Contacts
With ground plate type : 80 / 100 / 120 / 140
Without ground plate type : 96 / 120 / 144 / 168
q
Improved Transmission Efficiency
Between Boards
sWith
GND Plate Type
Transmission characteristics have been improved through a
design that fixes ground plates to both sides of the header
and receptacle.
q
10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
Ground
plate
Signal contact
Housing
q
Metal Fittings for Added Solder Weld
Strength
Metal fittings provide greater adhesion to the board,
protecting against peeling. The unique connector design
provides a connection between the fitting and the ground
plate for a stronger ground.
mm
.75
0
mm
0.5
mm
.75
0
Metal fitting
Ground plate and metal
fitting make contact
q
Suited to High-Density Applications
The signal contact pitch of 0.5 mm produces a smaller
connector utilizing less board area for mounting.
qCut
Section
q
High contact reliability
Effective mating length is 1.1 mm for signal contacts.
q
Optional Ground Plate
An alternate style without the ground plate is available. The
space provided by the ground plate removal has been filled
with additional signal contacts.
sSignal
Integrity Features
qInsertion-Loss-to-Crosstalk-Ratio(ICR)
The insertion-loss-to-crosstalk-ratio (ICR) with five-
aggressor differential FEXT meets the extrapolated
IEEE 802.3ap specification for 10
+
Gbps.
60
50
40
ICR (dB)
30
20
10
0
ICR
ICR spec
0
2
4
6
Frequency (GHz)
8
10
Z (Ohm)
115
110
105
100
95
90
S(3,3)
85
0
200
400
600
Time (ps)
800
1000
qDifferential
Impedance
The differential impedance is within 100 +/- 10 ohms
at 30ps rise time (20% to 80%).
sStack
Height
qWith
ground plate
Headers
Receptacles
FX10#-*S/*-SV
FX10#-*P/*-SV FX10#–*P/*–SV1
( )
4mm
5mm
qWithout
ground plate
Headers
Receptacles
FX10#-*S-SV
FX10#-*P-SV FX10–*P–SV1 FX10#-168P-SV2 FX10#-168P-SV3 FX10#-168P-SV4
4mm
5mm
6mm
7mm
8mm
(H):Reference dimension
2011.01
w
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