F-219
MLE–150–01–G–DV
MLE–120–01–G–DV
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
CLM–126–02–F–D
CLM–111–02–L–D
(1.00 mm) .0394"
CLM, MLE SERIES
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
or www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
CLM: Phosphor Bronze
MLE: BeCu
Plating:
CLM: Au or Sn
over 50 µ" (1.27 µm) Ni
MLE: Au over 10 µ"
(0.25 µm) Ni
Current Rating (CLM/FTM):
2.8 A per pin
(2 pins powered)
Current Rating (MLE/FTM):
2.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Max Cycles:
CLM: 100 with 10 µ" (0.25 µm) Au
Voltage Rating:
MLE: 310 VAC
Insertion Depth:
CLM: Top Entry = (1.40 mm)
.055" min., Bottom Entry =
(2.41 mm) .095" min.
(Add board thickness for
correct post OAL)
MLE: (1.63 mm) .064" to
(3.18 mm) .125" with
(0.38 mm) .015" wipe,
pass-through, or
(2.44 mm) .096" minimum
for bottom entry
Normal Force:
CLM: 40 grams (0.39 N) average
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
CLM
Mates with:
FTM, FTMH, MW
1
NO. PINS
PER ROW
02
PLATING
OPTION
D
OPTIONS
02 thru 50
= Gold flash on
contact,
Matte Tin on tail
–F
–L
= Bottom Entry
(Required for bottom entry)
–BE
–K
–P
(1.00)
.03937
100
No. of positions x (1.00) .03937
+ (0.318) .0125
02
(5.72)
.225
x
(3.57)
.140
(2.54)
.100
(2.41)
.095
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
= (3.50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
= Pick & Place Pad
(7 positions minimum)
–P
(8.26) .325
by
A
(2.26)
.089
(1.36)
.054
(0.89) .035
DIA
(7.00)
.275
(3.00)
.118
(1.00)
.03937
(2.12)
.084
(0.28)
.011
01
(3.81)
.150
= Pick & Place Pad with
integral Alignment Pin
–PA
= Tape & Reel Packaging
–TR
APPLICATION
PIN/ROW
04-15
16-50
A
(3.56)
.140
(7.11)
.280
–PA
ALSO AVAILABLE
(MOQ Required)
• Alignment pin
• Other Gold plating options
Pass-Thru
MLE
Mates with:
FTM, FTMH, MW
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTIONS
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
02 thru 50
No. of positions
x (1.00) .03937 + (0.20) .008
= 10 µ"
(0.25 µm)
Gold
–G
FILE NO. E111594
100
(1.00)
02
.03937
(3.07)
.121
(0.64)
.025
DIA
(0.71)
.028
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion
–A
–A
(6.35)
.250
x
(3.18)
.125
(3.50)
.138
= (4.00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
–K
–P
(1.00)
.03937
(0.30)
.012
01
(4.32)
.170
= Metal Pick & Place Pad
(5 positions minimum)
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(3.12)
.123
(3.30)
.130
= Tape & Reel Packaging
–TR
–P
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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Embedded System
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