935362253557 datasheet, PDF - EEWORLD Datasheet

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935362253557: DescriptionRISC Microcontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，83 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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935362253557 Overview

RISC Microcontroller

935362253557 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	,
Reach Compliance Code	unknown
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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NXP Semiconductors

Data Sheet: Advance Information

Document Number S32K1XX

Rev. 8, 06/2018

S32K1xx Data Sheet

Notes

• Technical information for S32K118 device is

preliminary, until this device achieves qualification.

• Following two are the available attachments with

Datasheet:

– S32K1xx_Orderable_Part_Number_ List.xlsx

– S32K1xx_Power_Modes_Configuration.xlsx

Key Features

• Operating characteristics

– Voltage range: 2.7 V to 5.5 V

– Ambient temperature range: -40 °C to 105 °C for

HSRUN mode, -40 °C to 125 °C for RUN mode

• Arm™ Cortex-M4F/M0+ core, 32-bit CPU

– Supports up to 112 MHz frequency (HSRUN mode)

with 1.25 Dhrystone MIPS per MHz

– Arm Core based on the Armv7 Architecture and

Thumb®-2 ISA

– Integrated Digital Signal Processor (DSP)

– Configurable Nested Vectored Interrupt Controller

(NVIC)

– Single Precision Floating Point Unit (FPU)

• Clock interfaces

– 4 - 40 MHz fast external oscillator (SOSC)

– 48 MHz Fast Internal RC oscillator (FIRC)

– 8 MHz Slow Internal RC oscillator (SIRC)

– 128 kHz Low Power Oscillator (LPO)

– Up to 112 MHz (HSRUN) System Phased Lock

Loop (SPLL)

– Up to 50 MHz DC external square wave input clock

– Real Time Counter (RTC)

S32K1XX

• Power management

– Low-power Arm Cortex-M4F/M0+ core with

excellent energy efficiency

– Power Management Controller (PMC) with multiple

power modes: HSRUN, RUN, STOP, VLPR, and

VLPS. Note: CSEc (Security) or EEPROM writes/

erase will trigger error flags in HSRUN mode (112

MHz) because this use case is not allowed to

execute simultaneously. The device will need to

switch to RUN mode (80 Mhz) to execute CSEc

(Security) or EEPROM writes/erase.

– Clock gating and low power operation supported on

specific peripherals.

• Memory and memory interfaces

– Up to 2 MB program flash memory with ECC

– 64 KB FlexNVM for data flash memory with ECC

and EEPROM emulation. Note: CSEc (Security) or

EEPROM writes/erase will trigger error flags in

HSRUN mode (112 MHz) because this use case is

not allowed to execute simultaneously. The device

will need to switch to RUN mode (80 MHz) to

execute CSEc (Security) or EEPROM writes/erase.

– Up to 256 KB SRAM with ECC

– Up to 4 KB of FlexRAM for use as SRAM or

EEPROM emulation

– Up to 4 KB Code cache to minimize performance

impact of memory access latencies

– QuadSPI with HyperBus™ support

• Mixed-signal analog

– Up to two 12-bit Analog-to-Digital Converter

(ADC) with up to 32 channel analog inputs per

module

– One Analog Comparator (CMP) with internal 8-bit

Digital to Analog Converter (DAC)

• Debug functionality

– Serial Wire JTAG Debug Port (SWJ-DP) combines

– Debug Watchpoint and Trace (DWT)

– Instrumentation Trace Macrocell (ITM)

– Test Port Interface Unit (TPIU)

– Flash Patch and Breakpoint (FPB) Unit

• Human-machine interface (HMI)

– Up to 156 GPIO pins with interrupt functionality

– Non-Maskable Interrupt (NMI)

This document contains information on a pre-production product. Specifications

and pre-production information herein are subject to change without notice.

• Communications interfaces

– Up to three Low Power Universal Asynchronous Receiver/Transmitter (LPUART/LIN) modules with DMA support

and low power availability

– Up to three Low Power Serial Peripheral Interface (LPSPI) modules with DMA support and low power availability

– Up to two Low Power Inter-Integrated Circuit (LPI2C) modules with DMA support and low power availability

– Up to three FlexCAN modules (with optional CAN-FD support)

– FlexIO module for emulation of communication protocols and peripherals (UART, I2C, SPI, I2S, LIN, PWM, etc).

– Up to one 10/100Mbps Ethernet with IEEE1588 support and two Synchronous Audio Interface (SAI) modules.

• Safety and Security

– Cryptographic Services Engine (CSEc) implements a comprehensive set of cryptographic functions as described in the

SHE (Secure Hardware Extension) Functional Specification. Note: CSEc (Security) or EEPROM writes/erase will

trigger error flags in HSRUN mode (112 MHz) because this use case is not allowed to execute simultaneously. The

device will need to switch to RUN mode (80 MHz) to execute CSEc (Security) or EEPROM writes/erase.

– 128-bit Unique Identification (ID) number

– Error-Correcting Code (ECC) on flash and SRAM memories

– System Memory Protection Unit (System MPU)

– Cyclic Redundancy Check (CRC) module

– Internal watchdog (WDOG)

– External Watchdog monitor (EWM) module

• Timing and control

– Up to eight independent 16-bit FlexTimers (FTM) modules, offering up to 64 standard channels (IC/OC/PWM)

– One 16-bit Low Power Timer (LPTMR) with flexible wake up control

– Two Programmable Delay Blocks (PDB) with flexible trigger system

– One 32-bit Low Power Interrupt Timer (LPIT) with 4 channels

– 32-bit Real Time Counter (RTC)

• Package

– 32-pin QFN, 48-pin LQFP, 64-pin LQFP, 100-pin LQFP, 100-pin MAPBGA, 144-pin LQFP, 176-pin LQFP package

options

• 16 channel DMA with up to 63 request sources using DMAMUX

S32K1xx Data Sheet, Rev. 8, 06/2018

NXP Semiconductors

Table of Contents

Block diagram.................................................................................... 4

Feature comparison............................................................................ 5

Ordering information......................................................................... 7

3.1 Selecting orderable part number ...............................................7

3.2 Ordering information ................................................................ 8

General............................................................................................... 9

4.1 Absolute maximum ratings........................................................9

4.2 Voltage and current operating requirements..............................10

4.3 Thermal operating characteristics..............................................11

4.4 Power and ground pins.............................................................. 12

4.5 LVR, LVD and POR operating requirements............................14

4.6 Power mode transition operating behaviors.............................. 15

4.7 Power consumption................................................................... 16

4.8 ESD handling ratings.................................................................21

4.9 EMC radiated emissions operating behaviors........................... 21

I/O parameters....................................................................................22

5.1 AC electrical characteristics...................................................... 22

5.2 General AC specifications......................................................... 22

5.3 DC electrical specifications at 3.3 V Range.............................. 23

5.4 DC electrical specifications at 5.0 V Range.............................. 24

5.5 AC electrical specifications at 3.3 V range .............................. 25

5.6 AC electrical specifications at 5 V range ................................. 25

5.7 Standard input pin capacitance.................................................. 26

5.8 Device clock specifications....................................................... 26

Peripheral operating requirements and behaviors.............................. 27

6.1 System modules......................................................................... 27

6.2 Clock interface modules............................................................ 27

6.2.1

6.2.2

6.2.3

External System Oscillator electrical specifications....27

External System Oscillator frequency specifications . 29

System Clock Generation (SCG) specifications.......... 31

6.2.3.1

Fast internal RC Oscillator (FIRC)

electrical specifications............................ 31

6.2.3.2

Slow internal RC oscillator (SIRC)

electrical specifications ........................... 31

6.2.4

Low Power Oscillator (LPO) electrical specifications

......................................................................................32

6.4.2

6.3.2

6.3.1.2

6.2.5

SPLL electrical specifications .....................................32

6.3 Memory and memory interfaces................................................32

6.3.1

Flash memory module (FTFC) electrical

specifications................................................................32

6.3.1.1

Flash timing specifications —

commands................................................ 32

Reliability specifications..........................37

QuadSPI AC specifications..........................................38

6.4 Analog modules......................................................................... 42

6.4.1

ADC electrical specifications...................................... 42

6.4.1.1

6.4.1.2

12-bit ADC operating conditions............. 42

12-bit ADC electrical characteristics....... 44

CMP with 8-bit DAC electrical specifications............ 46

6.5 Communication modules........................................................... 50

6.5.1

6.5.2

6.5.3

6.5.4

6.5.5

6.5.6

6.5.7

LPUART electrical specifications............................... 50

LPSPI electrical specifications.................................... 50

LPI2C electrical specifications.................................... 56

FlexCAN electical specifications.................................57

SAI electrical specifications........................................ 57

Ethernet AC specifications.......................................... 59

Clockout frequency......................................................62

6.6 Debug modules.......................................................................... 62

6.6.1

6.6.2

6.6.3

SWD electrical specofications .................................... 62

Trace electrical specifications......................................64

JTAG electrical specifications..................................... 65

Thermal attributes.............................................................................. 68

7.1 Description.................................................................................68

7.2 Thermal characteristics..............................................................68

7.3 General notes for specifications at maximum junction

temperature................................................................................ 73

Dimensions.........................................................................................74

8.1 Obtaining package dimensions ................................................. 74

Pinouts................................................................................................75

9.1 Package pinouts and signal descriptions....................................75

10 Revision History.................................................................................75

S32K1xx Data Sheet, Rev. 8, 06/2018

NXP Semiconductors

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