5962-8961406MXA datasheet, PDF

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5962-8961406MXA: DescriptionUVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32; Categorystorage storage; File Size326KB，13 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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5962-8961406MXA Overview

UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32

5962-8961406MXA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	WDIP, DIP32,.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	120 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T32
JESD-609 code	e0
length	42.1005 mm
memory density	1048576 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.588 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

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Description	UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 128KX8, 250ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 150ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32	UVPROM, 128KX8, 120ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 128KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 128KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
Parts packaging code	DIP	QFJ	DIP	DIP	DIP	QFJ	QFJ	QFJ
package instruction	WDIP, DIP32,.6	WQCCN,	WDIP,	WDIP,	WDIP, DIP32,.6	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55	WQCCN,
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	120 ns	250 ns	250 ns	200 ns	150 ns	120 ns	150 ns	200 ns
JESD-30 code	R-GDIP-T32	R-CQCC-N32	R-GDIP-T32	R-GDIP-T32	R-GDIP-T32	R-CQCC-N32	R-CQCC-N32	R-CQCC-N32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	42.1005 mm	13.97 mm	42.1005 mm	42.1005 mm	42.1005 mm	13.97 mm	13.97 mm	13.97 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP	WQCCN	WDIP	WDIP	WDIP	WQCCN	WQCCN	WQCCN
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.588 mm	3.556 mm	5.588 mm	5.588 mm	5.588 mm	3.556 mm	3.556 mm	3.556 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	TIN LEAD
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD	QUAD
width	15.24 mm	11.43 mm	15.24 mm	15.24 mm	15.24 mm	11.43 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	1	1	1	1	1	1
Maker	AMD	AMD	AMD	AMD	-	-	-	AMD

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