K9F1208Q0B
K9F1208D0B
K9F1208U0B
Preliminary
FLASH MEMORY
Document Title
64M x 8 Bit NAND Flash Memory
Revision History
Revision No. History
0.0
0.1
0.2
Initial issue.
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.
1. PKG(TSOP1, WSOP1) Dimension Change
Draft Date
Aug. 24th 2003
Apr. 24th 2004
May. 24th 2004
Remark
Advance
Preliminary
Preliminary
Note : For more detailed features and specifications including FAQ, please refer to Samsung’ Flash web site.
s
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near you.
1
K9F1208Q0B
K9F1208D0B
K9F1208U0B
Preliminary
FLASH MEMORY
64M x 8 Bit / 32M x 16 Bit NAND Flash Memory
PRODUCT LIST
Part Number
K9F1208Q0B-D,H
K9F1208D0B-Y,P
K9F1208D0B-D,H
K9F1208U0B-Y,P
K9F1208U0B-D,H
K9F1208U0B-V,F
2.7 ~ 3.6V
Vcc Range
1.70 ~ 1.95V
2.4 ~ 2.9V
PKG Type
TBGA
TSOP1
TBGA
TSOP1
TBGA
WSOP1
FEATURES
•
Voltage Supply
- 1.8V device(K9F1208Q0B) : 1.70~1.95V
- 2.65V device(K9F1208D0B) : 2.4~2.9V
- 3.3V device(K9F1208U0B) : 2.7 ~ 3.6 V
•
Organization
- Memory Cell Array : (64M + 2048K)bit x 8 bit
- Data Register : (512 + 16)bit x 8bit
•
Automatic Program and Erase
- Page Program : (512 + 16)Byte
- Block Erase : (16K + 512)Byte
•
Page Read Operation
- Page Size : (512 + 16)Byte
- Random Access
: 12µs(Max.)
- Serial Page Access : 50ns(Min.)
•
Fast Write Cycle Time
- Program time : 200µs(Typ.)
- Block Erase Time : 2ms(Typ.)
•
Command/Address/Data Multiplexed I/O Port
•
Hardware Data Protection
- Program/Erase Lockout During Power Transitions
•
Reliable CMOS Floating-Gate Technology
- Endurance
: 100K Program/Erase Cycles
- Data Retention : 10 Years
•
Command Register Operation
•
Intelligent Copy-Back
•
Unique ID for Copyright Protection
•
Package
- K9F1208X0B-YCB0/YIB0
48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)
- K9F1208X0B-DCB0/DIB0
63- Ball TBGA (8.5 x 15 , 1.0 mm width)
- K9F1208U0B-VCB0/VIB0
48 - Pin WSOP I (12X17X0.7mm)
- K9F1208X0B-PCB0/PIB0
48 - Pin TSOP I (12 x 20 / 0.5 mm pitch)- Pb-free Package
- K9F1208X0B-HCB0/HIB0
63- Ball TBGA - Pb-free Package
- K9F1208U0B-FCB0/FIB0
48 - Pin WSOP I (12X17X0.7mm)- Pb-free Package
* K9F1208U0B-V,F(WSOPI ) is the same device as
K9F1208U0B-Y,P(TSOP1) except package type.
GENERAL DESCRIPTION
Offered in 64Mx8bit the K9F1208X0B is 512M bit with spare 16M bit capacity. The device is offered in 1.8V, 2.65V, 3.3V Vcc. Its
NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be performed
in typical 200µs on the 528-byte page and an erase operation can be performed in typical 2ms on a 16K-byte block. Data in the page
can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command
input. The on-chip write control automates all program and erase functions including pulse repetition, where required, and internal
verification and margining of data. Even the write-intensive systems can take advantage of the K9F1208X0B′s extended reliability of
100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F1208X0B is an
optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring
non-volatility.
2
K9F1208Q0B
K9F1208D0B
K9F1208U0B
PIN CONFIGURATION (TSOP1)
K9F1208U0B-YCB0,PCB0/YIB0,PIB0
N.C
N.C
N.C
N.C
N.C
N.C
R/B
RE
CE
N.C
N.C
Vcc
Vss
N.C
N.C
CLE
ALE
WE
WP
N.C
N.C
N.C
N.C
N.C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
N.C
N.C
N.C
N.C
I/O7
I/O6
I/O5
I/O4
N.C
N.C
N.C
Vcc
Vss
N.C
N.C
N.C
I/O3
I/O2
I/O1
I/O0
N.C
N.C
N.C
N.C
Preliminary
FLASH MEMORY
PACKAGE DIMENSIONS
48-PIN LEAD/LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I)
48 - TSOP1 - 1220F
Unit :mm/Inch
0.10
MAX
0.004
#48
( 0.25 )
0.010
12.40
0.488 MAX
#24
#25
1.00
±0.05
0.039
±0.002
0.25
0.010 TYP
18.40
±0.10
0.724
±0.004
+0.075
20.00
±0.20
0.787
±0.008
0.20
-0.03
+0.07
#1
0.008
-0.001
0.16
-0.03
+0.07
+0.003
0.50
0.0197
12.00
0.472
0.05
0.002 MIN
0.125
0.035
0~8°
0.45~0.75
0.018~0.030
( 0.50 )
0.020
3
0.005
-0.001
+0.003
1.20
0.047MAX
K9F1208Q0B
K9F1208D0B
K9F1208U0B
PIN CONFIGURATION (TBGA)
K9F1208X0B-DCB0,HCB0/DIB0,HIB0
1
N.C N.C
Preliminary
FLASH MEMORY
2
3
4
5
6
N.C N.C
N.C N.C
A
B
N.C
/WP
NC
ALE
/RE
NC
NC
NC
I/O0
I/O1
I/O2
Vss
CLE
NC
NC
NC
NC
NC
/CE
NC
NC
NC
NC
NC
/WE
NC
NC
NC
NC
NC
R/B
NC
NC
NC
NC
Vcc
I/O7
Vss
C
NC
D
NC
E
NC
F
NC
G
H
NC
Vss
VccQ I/O5
I/O6
I/O3 I/O4
N.C N.C
N.C N.C
N.C N.C
N.C N.C
Top View
4
Package Dimensions
63-Ball TBGA (measured in millimeters)
FLASH MEMORY
Top View
Bottom View
#A1 INDEX MARK(OPTIONAL)
8.50
±0.10
6
8.50
±0.10
0.80 x 9= 7.20
0.80 x 5= 4.00
0.80
5 4 3 2
A
1
B
#A1
(Datum A)
A
B
0.80 x 11= 8.80
0.80 x 7= 5.60
2.00
0.32
±0.05
0.45
±0.05
0.90
±0.10
(Datum B)
C
D
E
0.80
15.00
±0.10
2.80
F
G
H
63-∅0.45
±0.05
∅
0.20
M
A B
Side View
15.00
±0.10
0.10MAX
5
15.00
±0.10
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