|
2198339-6 |
2170088-2 |
2170088-1 |
VS-720-LPC-CBD-622.080 |
2198339-2 |
2198318-6 |
2180324-6 |
2180324-2 |
| Description |
zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY |
(2170088-2) ZSFP+ Connector,15u" |
(2170088-1) ZSFP+ Connector,30u" |
SAW Oscillator, 622.08MHz Nom |
zSFP+ STACKED 2X6 RECEPTACLE ASSEMBLY |
Telecom and Datacom Connector, 40 Contact(s), Press Fit Terminal |
Telecom and Datacom Connector, 160 Contact(s), Press Fit Terminal |
(2180324-2) zSFP+ STACKED 2X4 RECEPTACLE ASSEMBLY |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
conform to |
| Reach Compliance Code |
unknow |
compliant |
compliant |
compliant |
unknow |
compliant |
compliant |
compliant |
| Brand Name |
TE Connectivity |
TE Connectivity |
TE Connectivity |
- |
TE Connectivity |
- |
- |
TE Connectivity |
| Connector type |
TELECOM AND DATACOM CONNECTOR |
- |
TELECOM AND DATACOM CONNECTOR |
- |
TELECOM AND DATACOM CONNECTOR |
TELECOM AND DATACOM CONNECTOR |
TELECOM AND DATACOM CONNECTOR |
TELECOM AND DATACOM CONNECTOR |
| Contact to complete cooperation |
NOT SPECIFIED |
- |
NOT APPLICABLE |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT APPLICABLE |
NOT APPLICABLE |
| Contact material |
NOT SPECIFIED |
- |
NOT APPLICABLE |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT APPLICABLE |
NOT APPLICABLE |
| Objectid |
- |
1424906863 |
1424906862 |
7400622587 |
- |
1474147168 |
8003528812 |
8003528808 |
| Samacsys Description |
- |
TE CONNECTIVITY - 2170088-2 - Pluggable I/O Connector, zSFP+, 20 Contacts, 1 x 1 (Single), Surface Mount |
SFP, SFP+ & zSFP+, Connector, Data Rate (Max) 32 Gb/s, SFP+, Surface Mount Mount, Cable-to-Board, 20 Position, .031 in [.8 mm] Centerline |
- |
- |
40 (20 x 2) Position zSFP+ Receptacle with Cage, Ganged (2x1) Connector Press-Fit Through Hole, Right Angle |
Configuration Features: Number of Positions 160 | Port Matrix Configuration 2 x 4 | Number of Ports 8 | Lightpipe Style Standard | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 32 |
Configuration Features: Lightpipe Style Standard | Port Matrix Configuration 2 x 4 | Number of Positions 160 | Number of Ports 8 | Contact Features: Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 32 |
| Samacsys Manufacturer |
- |
TE Connectivity |
TE Connectivity |
- |
- |
TE Connectivity |
TE Connectivity |
TE Connectivity |
| Samacsys Modified On |
- |
2020-10-07 00:36:05 |
2022-05-20 06:27:17 |
- |
- |
2023-12-26 08:58:54 |
2024-04-03 11:24:51 |
2024-04-03 11:24:51 |
| Maximum operating temperature |
- |
85 °C |
85 °C |
70 °C |
- |
105 °C |
105 °C |
105 °C |
| Minimum operating temperature |
- |
-55 °C |
-55 °C |
- |
- |
-55 °C |
-55 °C |
-55 °C |
| YTEOL |
- |
- |
7.75 |
4.5 |
- |
7.97 |
7.78 |
7.78 |