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2198224-1

Description
SFP+ Enhanced 1x2, PCI Heatsink
CategoryThe connector   
File Size802KB,2 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance
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2198224-1 Overview

SFP+ Enhanced 1x2, PCI Heatsink

2198224-1 Parametric

Parameter NameAttribute value
DimensionsSFP+
cage typeLinkage
Radiator includedyes
Connector Systemcable to board
Sealableyes
Connectors and terminals terminate toA printed circuit board
Port matrix configuration1 x 2
Number of ports2
Data rate (max) (Gb/s)16
Radiator typePin
Radiator height categoryPCI
Radiator height4.2 mm [ .165 in ]
PCB Termination MethodsThrough hole - solderless connection
PCB installation methodThrough hole solderless connection
Connector mounting typeboard mounting
cage materialnickel silver
PCB thickness (recommended)1.5 mm [ .059 in ]
tail length2.05 mm [ .081 in ]
Working group temperature range-55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O productsSFP+ SMT connector
Pluggable I/O ApplicationsSFP+ enhanced
Circuit ApplicationSignal
Compatible radiatorsyes
Encapsulation methodPallets, boxes and pallets
EMI containment feature typesElastomeric sealing ring
Light pipe includedno
8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
7
20
6
1
5
4
3
LOC
2
DIST
1
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
C
COPYRIGHT
20
PIN TYPE
HEAT SINK
2
MATERIAL:
CAGE ASSEMBLY: 0.25mm THICK NICKEL SILVER ALLOY
GASKET RETENTION PLATE: STAINLESS STEEL
EMI GASKET: PLATED FILLED SILICONE
HEATHSINK CLIP: STAINLESS STEEL
HEATSINK: ALUMINUM
FINISH:
HEATSINK: ELECTROLESS NICKEL
HEATSINK CLIP: PASSIVATE
DATUM AND BASIC DIMENSIONS ESTABLISHED BY CUSTOMER.
PADS AND VIAS CHASSIS GROUND.
10
GP
00
A
A1
RELEASED PER ECO-12-013192
RELEASED PER ECO-13-0014600
05SEP2012
12OCT2013
BMM
PP
MRS
SH
MINIMUM PC BOARD THICKNESS:
SINGLE SIDED: 1.5mm
3
4
11. CERTAIN MATING TRANCEIVERS MAY REQUIRE ADDITIONAL PCB THICKNESS
THAT WOULD NEED TO BE DETERMINED BY THE CUSTOMER.
12. PRODUCT COMPLIES WITH SPECIFICATION SFF-8433 IMPROVED PLUGGABLE
FORM FACTOR FOR SFP+ GANGED CAGES.
13
D
5. MATES WITH SFP MSA COMPLIANT RECIEVERS.
6. INTERPRETATION OF DATUM REFERENCE FRAME IN ACCORDANCE
WITH SECT 4.4.1.1 OR ASME Y14.5M-1994.
2198224-1,2,3,4
FINISHED ASSEMBLY
7
8
9
D
DIMENSION APPLIES PRIOR TO INSERTION OF SFP MODULE.
FIN TYPE
HEAT SINK
HOLE PATTERN REPEATS FOR EACH PORT, SPACING BETWEEN
PORTS IS 14.25mm.
REFERENCE APPLICATION SPEC. 114-13120, HOLE A, FOR RECOMMENDED
DRILL HOLE DIAMETER AND PLATING THICKNESS.
REFERENCE APPLICATION SPEC. 114-13120, HOLE B, FOR RECOMMENDED
DRILL HOLE DIAMETER AND PLATING THICKNESS.
2X 14 0.1
PORT OPENING
( 49.2 )
C
2198224-5,6,7,8
FINISHED ASSEMBLY
2X 8.95 0.15
PORT OPENING
( 9.7 )
A MAX
13
C
( 14.25 )
( 7.125 )
( 28.75 )
MEASURED ACROSS CAGE SIDES
34.25
MIN
8X R 0.3
MAX
( 2.05 ) TYP
38.9
0.3
GUIDE PINS
B
B
2X 10.4
( 1.5 ) MIN
10
PCB THICKNESS
+0.10
-0.14
TOP OF PCB
TO INSIDE OF
BEZEL CUTOUT
0.23
2X 29.7
RECOMMENDED BEZEL CUT-OUT
SINGLE SIDED APPLICATIONS
SCALE
4:1
A
( 35.4 )
2198224
MOUNTED ON PC BOARD
SHOWN THRU RECOMMENDED BEZEL
FIN TYPE
FIN TYPE
FIN TYPE
FIN TYPE
PIN TYPE
PIN TYPE
PIN TYPE
HEAT
SINK
PIN TYPE
DWN
CHK
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
22.5
18.1
15.5
22.5
18.1
15.5
13.2
A MAX
B. MATTHEWS
M. SCHMITT
M. SCHMITT
108-2364
12OCT2011
12OCT2011
12OCT2011
NETWORKING, SHORT
SAN
PCI
NETWORKING, TALL
2198224-8
2198224-7
2198224-6
2198224-5
2198224-4
2198224-3
2198224-2
2198224-1
PART
NUMBER
A
13.2
NETWORKING, SHORT
SAN
PCI
APPLICATION
NETWORKING, TALL
THIS DRAWING IS A CONTROLLED DOCUMENT.
TE Connectivity
NAME
mm
APVD
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
0.13
0.1
0.08
.05
.05
PRODUCT SPEC
APPLICATION SPEC
SFP+ ENHANCED 1X2 CAGE ASSEMBLY,
PRESS-FIT, EMI GASKET WITH HEATSINK
-
SIZE
CAGE CODE
DRAWING NO
1
WEIGHT
114-13120
1
4805 (3/11)
2
-
Customer Drawing
A1
00779
RESTRICTED TO
2198224
SCALE
5:1
SHEET
1
OF
2
REV
-
A1

2198224-1 Related Products

2198224-1 2198224-2 2198224-3 2198224-4
Description SFP+ Enhanced 1x2, PCI Heatsink SFP+ Enhanced 1x2, SAN Heatsink SFP+ Enhanced 1x2, Networking Heatsink SFP+ Enhanced 1x2, Networking Heatsink
Dimensions SFP+ SFP+ SFP+ SFP+
cage type Linkage Linkage Linkage Linkage
Radiator included yes yes yes yes
Connector System cable to board cable to board cable to board cable to board
Sealable yes yes yes yes
Connectors and terminals terminate to A printed circuit board A printed circuit board A printed circuit board A printed circuit board
Port matrix configuration 1 x 2 1 x 2 1 x 2 1 x 2
Number of ports 2 2 2 2
Data rate (max) (Gb/s) 16 16 16 16
Radiator type Pin Pin Pin Pin
Radiator height category PCI SAN short long
Radiator height 4.2 mm [ .165 in ] 6.5 mm [ .256 in ] 9.1 mm [ .358 in ] 13.5 mm [ .531 in ]
PCB Termination Methods Through hole - solderless connection Through hole - solderless connection Through hole - solderless connection Through hole - solderless connection
PCB installation method Through hole solderless connection Through hole solderless connection Through hole solderless connection Through hole solderless connection
Connector mounting type board mounting board mounting board mounting board mounting
cage material nickel silver nickel silver nickel silver nickel silver
PCB thickness (recommended) 1.5 mm [ .059 in ] 1.5 mm [ .059 in ] 1.5 mm [ .059 in ] 1.5 mm [ .059 in ]
tail length 2.05 mm [ .081 in ] 2.05 mm [ .081 in ] 2.05 mm [ .081 in ] 2.05 mm [ .081 in ]
Working group temperature range -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O products SFP+ SMT connector SFP+ SMT connector SFP+ SMT connector SFP+ SMT connector
Pluggable I/O Applications SFP+ enhanced SFP+ enhanced SFP+ enhanced SFP+ enhanced
Circuit Application Signal Signal Signal Signal
Compatible radiators yes yes yes yes
Encapsulation method Pallets, boxes and pallets Pallets, boxes and pallets Pallets, boxes and pallets Boxes, boxes and trays
EMI containment feature types Elastomeric sealing ring Elastomeric sealing ring Elastomeric sealing ring Elastomeric sealing ring
Light pipe included no no no no
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