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2110412-2

Description
1x3 QSFP Kit Assy Sqr LP, SAN Htsnk
CategoryThe connector   
File Size2MB,5 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Environmental Compliance  
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2110412-2 Overview

1x3 QSFP Kit Assy Sqr LP, SAN Htsnk

2110412-2 Parametric

Parameter NameAttribute value
DimensionsQSFP+
Radiator includedyes
cage typeLinkage
Connector Systemcable to board
Sealableno
Connectors and terminals terminate toA printed circuit board
Port matrix configuration1 x 3
Number of ports3
Light pipe configurationboth sides
Number of rear EONs per port post1
Data rate (max) (Gb/s)28
Radiator typePin
Radiator height categorySAN
Radiator height6.5 mm [ .256 in ]
Radiator surface coatinganodized black
PCB terminal termination area plating materialstin
PCB Termination MethodsThrough hole - solderless connection
Connector mounting typeboard mounting
cage materialnickel silver
PCB thickness (recommended)1.45 mm [ .057 in ]
tail length2.05 mm [ .08 in ]
Working group temperature range-55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O productsQSFP cable assembly, QSFP MSA compatible transceiver
Pluggable I/O Applicationsstandard
Circuit ApplicationSignal
UL flammability ratingUL 94V-0
Encapsulation methodboxes and trays
EMI containment feature typesSeals for customer applications
Light pipe includedyes
Enhanced functionalitystandard
8
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
BY -
ALL RIGHTS RESERVED.
7
2008
6
5
4
3
LOC
2
DIST
1
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
C
COPYRIGHT
2008
GP
1
00
D
REVISED PER ECO-10-018054
REVISED PER ECO-12-005533
REVISED PER ECO-14-016878
04NOV2010
05APR2012
03DEC2014
CJV
JY
RG
EJB
AC
MC
MATERIALS:
CAGE ASSEMBLY: NICKEL SILVER, 0.25 THICK
HEAT SINK: ALUMINUM
HEAT SINK CLIP: STAINLESS STEEL
EMI SPRING: COPPER ALLOY
FRONT FLANGE: ZINC ALLOY
LIGHT PIPE: CLEAR POLYCARBONATE
PITCH BETWEEN PORTS OF ONE 1X3 CAGE ASSEMBLY.
SPACING BETWEEN CAGES ON THE SAME PC BOARD,
TO BE SPECIFIED BY CUSTOMER, MUST COMPLY WITH
MINIMUM DIMENSIONS SHOWN.
REFERENCE APPLICATION SPEC 114-13218 FOR
RECOMMENDED DRILL HOLE DIAMETER AND PLATING
THICKNESS.
DATUMS AND BASIC DIMENSIONS ESTABLISHED BY
CUSTOMER.
DIMENSION C IS THE NOMINAL THICKNESS OF CUSTOMER
SUPPLIED PC BOARD,
SINGLE SIDED PC BOARD MIN THICKNESS = 1.45mm
DOUBLE SIDED PC BOARD MIN THICKNESS = 2.2mm.
HEAT SINKS, LIGHT PIPES, AND CLIP SHIPPED
ASSEMBLED TO CAGE ASSEMBLY. CAGE ASSEMBLY MAY BE
PRESSED INTO THE PCB AS SHIPPED.
DATUM
-A-
IS TOP SURFACE OF PC BOARD.
9
10
11
DIMENSION APPLIES WITH MODULE INSERTED IN CAGE.
UNPLATED THRU HOLE.
MAXIMUM HEIGHT OF LED OFF BOARD: 0.9mm.
E
F
12. MATES WITH QSFP MSA COMPATIBLE TRANSCEIVER.
13
14
15
16
17
2
3
SURFACE TRACES PERMITTED WITHIN THIS AREA EXCEPT WHERE
CAGE STANDOFFS, SHOWN IN DETAIL S, CONTACT PC BOARD.
BASELINE FOR THESE DIMENSIONS IS THE CENTER OF
COMPLIANT PIN HOLE.
2D BARCODE AND DATE CODE (YYWWD) MARKED ON SIDE OF CAGE.
REFERENCE APP SPEC 114-13218 FOR GASKET THICKNESS
CALCULATION.
FINISH:
EMI SPRING: 2µm MINIMUM TIN
FRONT FLANGE: 3µm MINIMUM TIN OVER 1.27µm MINIMUM
NICKEL OVER 5.08µm MINIMUM COPPER
HEATSINK: NICKEL
HEAT SINKS AND CLIPS SHIPPED ASSEMBLED TO CAGE
ASSEMBLY. CAGE ASSEMBLY MAY BE PRESSED INTO THE
PCB AS SHIPPED. LIGHT PIPES, SHIPPED UNATTACHED,
MUST BE ASSEMBLED BY CUSTOMER AFTER THE CAGE IS
SEATED IN THE PCB.
D
D
4
5
3 MAX TYP
6
DETAIL
S
SCALE
20:1
13
18
7
8
C
C
( 60.57 )
( 1.66 )
( 60 )
9
B
MAX
2.2 MAX
2D BARCODE AND DATE CODE
SEE DETAIL
15
S
2X ( 19 )
2
B
B
EMI SPRINGS
7
7
18
23.0
16.0
13.7
B
NETWORKING
SAN
PCI
2110412-3
2110412-2
2110412-1
PART
NUMBER
A
A
CAGE ASSEMBLY
FRONT FLANGE
THIS DRAWING IS A CONTROLLED DOCUMENT.
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
DWN
CHK
C. VALENTINE
J. PETERSON
J. PETERSON
108-2286
28FEB2008
28FEB2008
28FEB2008
NAME
HEAT SINK
PROFILE
TE Connectivity
mm
APVD
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
0.1
0.1
-
-
PRODUCT SPEC
APPLICATION SPEC
1X3 CAGE ASSEMBLY, BEHIND BEZEL,
W/ SQUARE LIGHT PIPES AND HEAT SINKS
QSFP
-
-
-
1
-
-
17
WEIGHT
114-13218
-
CUSTOMER DRAWING
A1
00779
SIZE
CAGE CODE
DRAWING NO
RESTRICTED TO
2110412
SCALE
4805 (3/11)
4:1
SHEET
1
OF
5
REV
-
F

2110412-2 Related Products

2110412-2 2110412-1
Description 1x3 QSFP Kit Assy Sqr LP, SAN Htsnk 1x3 QSFP Kit Assy Sqr LP, PCI Htsnk
Dimensions QSFP+ QSFP+
Radiator included yes yes
cage type Linkage Linkage
Connector System cable to board cable to board
Sealable no no
Connectors and terminals terminate to A printed circuit board A printed circuit board
Port matrix configuration 1 x 3 1 x 3
Number of ports 3 3
Light pipe configuration both sides both sides
Number of rear EONs per port post 1 1
Data rate (max) (Gb/s) 28 28
Radiator type Pin Pin
Radiator height category SAN PCI
Radiator height 6.5 mm [ .256 in ] 4.2 mm [ .165 in ]
Radiator surface coating anodized black anodized black
PCB terminal termination area plating materials tin tin
PCB Termination Methods Through hole - solderless connection Through hole - solderless connection
Connector mounting type board mounting board mounting
cage material nickel silver nickel silver
PCB thickness (recommended) 1.45 mm [ .057 in ] 1.45 mm [ .057 in ]
tail length 2.05 mm [ .08 in ] 2.05 mm [ .08 in ]
Working group temperature range -55 – 105 °C [ -67 – 221 °F ] -55 – 105 °C [ -67 – 221 °F ]
Suitable for pluggable I/O products QSFP cable assembly, QSFP MSA compatible transceiver QSFP cable assembly, QSFP MSA compatible transceiver
Pluggable I/O Applications standard standard
Circuit Application Signal Signal
UL flammability rating UL 94V-0 UL 94V-0
Encapsulation method boxes and trays boxes and trays
EMI containment feature types Seals for customer applications Seals for customer applications
Light pipe included yes yes
Enhanced functionality standard standard
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