4
THIS DRAWING IS UNPUBLISHED.
RELEASED FOR PUBLICATION
TE CONNECTIVITY
ALL RIGHTS RESERVED.
-
3
2
LOC
DIST
1
C
COPYRIGHT
-
IR
NOTES:
10.0
1,5±0,8
1
-
REVISIONS
P
LTR
DESCRIPTION
DATE
DWN
APVD
Y
Z
HOUSING RIB STRENGTHENNED,RAW MATERIAL CHANGED TO PA4T
06JAN2012
14JUN2016
PS
AD
RRP
SH
ECO-16-001320
TOLERANCES UNLESS OTHERWISE SPECIFIED: # 0.15.
CONTACT PLATING:
OVERALL: Ni 1.27µm MIN. ALL OVER THE CONTACTS
SOLDER ZONE: Sn 3.5-5.0µm ON THE SOLDER ZONE OF THE CONTACT
MATING ZONE: PLATING CONFIRMS TO PRODUCT REQUIREMENTS
-
AS PER SPECIFICATION 108-19117
MATERIALS:
HOUSING:
30% G.F. LCP, COLOR BLACK, UL 94V-0.
CONTACTS:
PHOSPHOR BRONZE
SOLDER BRACKET:
TINPLATED BRASS WITH NICKEL UNDERPLATE.
THIS JACK CAN ALSO BE APPLIED HANGING THROUGH A HOLE,
IN A PRINTED CIRCUIT BOARD. SEE LEFT PCB LAYOUT.
SURFACE CAN BE USED FOR PICKING THE MODULAR JACK WITH,
TYPE II SMD MACHINE.
ON 1-338086-4 AND 2-338086-4 ONLY CONTACTS B,C,D
ARE INSTALLED.
COPLANARITY MEASURED AT HEEL OF CONTACTS
COPLANARITY AT TIPS OF CONTACTS MAX. 0.18 mm
TAPE AND REEL PACKAGING ACCORDING TO EIA 481-3 SPECIFICATIONS.
INCLUDES KAPTON TAPE (10x11,5mm)
ON TOP SURFACE AS PICK AND PLACE FEATURE.
OBSOLETE PARTS: OBSOLETE CIS STREAMLINIG PER D. RENAUD/D.SINSI
& E
5
D
PIN 1
2
D
1.27
A
TYP.
3
13.35±0.10
9.83
6.60
5
B
C
D
E
F
11.5
4
5
6
7
5
2.2
REF
4.6
3.4
0.8 ±0,8
8
9
C
9
10
C
14.0
REF
2
2.3
12.7
11.8
6.8
R 0.50
B
8.0
2.5
1.5
5
0.10
7
2.2
6.8 x8.2mm
SECTION
B
A-A
0.10
REQUIRED SOLDER PASTE
THICKNESS 0.1mm MIN.
19.4
2.8
14.6
0.1
0.6
1.27
TYP.
4.5
19.4
REQUIRED SOLDER PASTE
THICKNESS 0.1mm MIN.
OBSOLETE
3.2
10
6 POS./6 CONT.
6 POS./4 CONT.
6 POS./6 CONT.
6 POS./4 CONT.
6 POS./6 CONT.
6 POS./6 CONT.
750 PCS ON n 560mm OD REEL.
BOTTOM ENTRY ORIENTATION PER DETAIL B2
750 PCS ON n 560mm OD REEL.
TOP ENTRY ORIENTATION PER DETAIL B1
300 PCS ON n 360mm OD REEL.
TOP ENTRY ORIENTATION PER DETAIL B1
300 PCS ON n 360mm OD REEL.
BOTTOM ENTRY ORIENTATION PER DETAIL B2
300 PCS ON n 360mm OD REEL.
TOP ENTRY ORIENTATION PER DETAIL B1
2-338086-5
2-338086-4
1-338086-7
2-338086-3
1-338086-6
1-338086-5
1-338086-4
PART NUMBER
TE Connectivity
6
0.6
0.4
PAD FOR
PIN 1
1.27
TYP.
9
9
8.8
2.5
13.8
0.7 0.1
(6X)
0.1
8.8
2.5
0.7 0.1
(6X)
6 POS./4 CONT.
6 POS./6 CONT.
REMARKS
THIS DRAWING IS A CONTROLLED DOCUMENT.
DIMENSIONS:
TOLERANCES UNLESS
OTHERWISE SPECIFIED:
DWN
CHK
PACKAGING
A
PAD FOR PIN 1
0.4R MAX.
E.v.EIJK
E.STELLINGA
22-Nov-96
dEC-96
8
1-338086-3
6
mm
APVD
HOLE FOR BOTTOM
ENTRY APPLICATION
DASHLINE INDICATES OUTLINE
OFJACK, CONTACTS AND BRACKET
PRINTED CIRCUIT BOARD LAYOUT (TOP ENTRY APPL.)
MATERIAL
0 PLC
1 PLC
2 PLC
3 PLC
4 PLC
ANGLES
FINISH
-
-
-
-
-
PRODUCT SPEC
R.SMEETS
-
NAME
A
APPLICATION SPEC
108-19117
114-19041
-
-
WEIGHT
PRINTED CIRCUIT BOARD LAYOUT (BOTTOM ENTRY APPL.)
1471-9 (3/11)
SEE NOTE 3
-
SEE NOTE 2
-
CUSTOMER DRAWING
A2
00779
SIZE
INVERTIBLE MODULAR JACK ASSEMBLY
SURFACE MOUNT APPLICATION
6/6 AND 6/4 POSITION LINE
CAGE CODE
DRAWING NO
RESTRICTED TO
338086
SCALE
1:1
SHEET
1
OF
2
REV
-
Z
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