B0202AG-00-6043-B datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> B0202AG-00-6043-B

B0202AG-00-6043-B: DescriptionFixed Resistor, Thin Film, 0.25W, 604000ohm, 100V, 0.1% +/-Tol, 300ppm/Cel, Surface Mount, 0202, CHIP; CategoryPassive components The resistor; File Size381KB，3 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/

Download Datasheet Parametric View All

B0202AG-00-6043-B Overview

Fixed Resistor, Thin Film, 0.25W, 604000ohm, 100V, 0.1% +/-Tol, 300ppm/Cel, Surface Mount, 0202, CHIP

B0202AG-00-6043-B Parametric

Parameter Name	Attribute value
Objectid	1579356371
package instruction	CHIP
Reach Compliance Code	compliant
ECCN code	EAR99
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
method of packing	TRAY
Rated power dissipation(P)	0.25 W
Rated temperature	70 °C
resistance	604000 Ω
Resistor type	FIXED RESISTOR
size code	0202
surface mount	YES
technology	THIN FILM
Temperature Coefficient	300 ppm/°C
Terminal shape	ONE SURFACE
Tolerance	0.1%
Operating Voltage	100 V

Preview

Download Datasheet

View All

Wire Bondable

Chip Resistors

WBC Series

•

Discrete or tapped schematics

•

MIL inspection available

•

High resistor density

IRC’s WBC series wire bondable chip resistors are ideally suited for

the most demanding hybrid application. The WBC combines IRC’s

TaNSil

tantalum nitride thin film technology with silicon substrate processing to produce an extremely small

footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil

resistor film.

Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Physical Data

R0202 - Discrete

(0.508mm ±0.025)

0.020˝ ±0.001

Electrical Data

Absolute Tolerance

Absolute TCR

Package Power Rating

(@ 70°C)

Rated Operating Voltage

√

(not to exceed P x R )

Operating Temperature

Back contact

Noise

Top contact

pad chamfered

0.004˝ min bond pad size

to ±0.1%

to ±25ppm/°C

250mW

100V

-55°C to +150°C

<-30dB

Oxidized Silicon

(10KÅ SiO

min)

0.010˝ ±0.001

(0.254mm ±0.025)

10KÅ minimum

15KÅ minimum

Silicon

(Al / Au optional)

3KÅ Au minimum

10KÅ Al minimum

Silicon Dioxide or

Silicon Nitride

0.004˝ min bond pad size

0.020˝ ±0.001

(0.508mm ±0.025)

B0202 - Discrete back contact

(0.508mm ±0.025)

0.020˝ ±0.001

Substrate Material

Top contact

Substrate Thickness

Aluminum

Gold

R0202 and

T0303

B0202

0.020˝ ±0.001

(0.508mm ±0.025)

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

(0.762mm ±0.025)

0.030˝ ±0.001

½R

Backside

0.030˝ ±0.001

(0.762mm ±0.025)

0.004˝ min bond pad size

Passivation

General Note

IRC reserves the right to make changes in product specification without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

A subsidiary of

TT electronics plc

WBC Series Issue January 2009 Sheet 1 of 3

Recommended Resources

Synchronous operation circuit of two AC commutator motors

Digital reverberator circuit

Bistable circuit with diode clamp

Zero type rectifier and voltage stabilizing circuit

Single-button ten-speed timer alarm switch

Computer motherboard circuit diagram 430TX_12

Can the electrolytic capacitor at the VDD pin of the NRF2401 wireless module be removed?: Can the electrolytic capacitor at the VDD pin of the NRF2401 wireless module be removed? There is no electrolytic capacitor in the reference design of the NRF2401 technical documentation, but it is ad...; dadaowaiguozhu RF/Wirelessly

Problems encountered in serial communication between upper and lower computers: The labview host computer sends a group of strings to the microcontroller: single character 0, single character 1, single character 2, single character 3, single character 4; single character 0 is fix...; qiwan stm32/stm8

Structure and Parameter Control of Transmission Line Model in HSPICE: Structure and Parameter Control of Transmission Line Model in HSPICE...; linda_xia Microchip MCU

Is there anything wrong with this circuit?: Using the optocoupler MOC3081 with zero-crossing trigger to control the unidirectional thyristor to achieve controlled rectification to control the motor, is there anything wrong with this circuit? I ...; gsy Industrial Control Electronics

msp430g2553 writes a timed capture, and the interrupt cannot enter: I use msp430g2553 to write a timing capture, but the interrupt can't be entered. Here is the program: void Timing_acquisition(void) { P1SEL|=BIT1; //P1.1 CCI0A P1DIR &=~BIT1; TACTL = TASSEL_2 + MC_2+T...; yezihoho TI Technology Forum

【Perf-V Evaluation】+ Design of simple functional programs (2): [i=s]This post was last edited by jinglixixi on 2021-4-22 03:57[/i]Earlier we introduced how to use a development board to implement the functions of logic gate circuits. This time we will try to simu...; jinglixixi FPGA/CPLD

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components