EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342M02C8J20R

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 8.2ohm, 40V, 5% +/-Tol, 300ppm/Cel, Surface Mount, 0505, CHIP
CategoryPassive components    The resistor   
File Size97KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

M55342M02C8J20R Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 8.2ohm, 40V, 5% +/-Tol, 300ppm/Cel, Surface Mount, 0505, CHIP

M55342M02C8J20R Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1923437886
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7
JESD-609 codee4
Manufacturer's serial numberM55342/02
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)0.125 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance8.2 Ω
Resistor typeFIXED RESISTOR
size code0505
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfacePalladium/Silver (Pd/Ag)
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage40 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/02 RM0505
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
125 mW
40 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 02 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /02 = RM0505
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.082
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.052 (.050 - .060)
.048 (.046 - .054)
.015 (.013 - .023)
.009 (.005 - .015)
.014 (.010 - .020)
.024 (.020 - .028)
.00315 grams
1.32
1.22
0.38
0.22
0.36
0.61
(1.27 - 1.52)
(1.17 - 1.37)
(0.33 - 0.58)
(0.13 - 0.38)
(0.25 - 0.51)
(0.51 - 0.71)
.052
.020
.031
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
A problem in the audio driver module in AT91RM9200 and UDA1380
Hello everyone! I am a novice in embedded development. There is a piece of code in the audio driver module of AT91RM9200 and UDA1380 that I don't understand. Can anyone explain it to me? There are man...
wangkj11 Embedded System
Reasons for blocked vias in PCB manufacturing
Analysis of the reasons for the blocked vias in PCB board making: Mainly in the copper deposition and electroplating process, the hole wall is not properly treated, such as: glue residue, alkaline deg...
ESD技术咨询 PCB Design
Embedded linux DDR stress test, SPI flash read and write test help
I'm looking for a solution or source code. I transplanted memtester myself but it shows syntax errors. . . Please transplant it or give me some guidance....
傻XX小魔法师 Linux and Android
Problems after successful driver uninstallation
The application layer code is as follows: mian() { HANDLE HAHA; HAHA = CreateEvent(NULL, FALSE, NULL, L"bb_write"); SetEvent(HAHA); } Driver layer: NTSTATUS DriverEntry( IN PDRIVER_OBJECT KeyDriverObj...
guiqixin100 Embedded System
How do RF circuits and digital circuits coexist harmoniously?
Monolithic RF devices greatly facilitate the application of wireless communication within a certain range. A complete wireless communication link can be formed by using a suitable microcontroller and ...
fish001 RF/Wirelessly
【TI Technical Article】: TI's new TMS320C66x fixed-point and floating-point DSP cores successfully challenge the speed limit
Texas Instruments' (TI) new TMS320C66x digital signal processor (DSP) cores not only bring significant performance improvements to the award-winning C64x+instruction set architecture (ISA) , but also ...
德仪DSP新天地 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2213  1385  2097  2454  646  45  28  43  50  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号