CTS
®
TABLE OF CONTENTS
PAGE
HI-TEMP FAN HEAT SINKS
ADHESIVE PEEL AND STICK HEAT SINKS
3
6
FORGED HEAT SINKS WITH PLATE FINS
FORGED HEAT SINKS WITH PIN FINS
CLIP AND TAPE STYLES
ZIF STANDARD CIRCUIT BOARD RETAINERS
ZIF III CIRCUIT BOARD RETAINERS
ZIF PRIME CIRCUIT BOARD RETAINERS
THERMAL LINKS FOR TO-5, TO-8 AND TO-18 TRANSISTORS
ADDITIONAL EXTRUDED PRODUCTS FOR TO-126, TO-202, TO-218 AND TO-220 TRANSISTORS
HEAT SINKS FOR METAL AND PLASTIC CASE, CASE-MOUNTED SEMICONDUCTORS
BOARD-MOUNTED AND VERTICALLY MOUNTED HEAT SINKS WITH BOARD-MOUNTED TABS
BOARD AND VERTICALLY MOUNTED HEAT SINKS
7
9
10
11
13
15
17
18
19
20
21
CORPORATE
PROFILE
CTS Electronic Components is a division within
CTS Corporation (NYSE: CTS), a leading designer
and manufacturer of electronic components and a
provider of electronics manufacturing services to
OEMs in the automotive, communications, defense
and aerospace, industrial and medical markets.
In 1997, CTS acquired Dynamics Corporation of
America, the parent corporation of the former
International
Electronic
Research
Corporation
(IERC). Since then, CTS has continued to develop,
manufacture and market a quality line of standard
and custom thermal management products and
rugged circuit board retainers for the electronics and
military industries.
2
Through the years, CTS has fine-tuned its business
systems to accommodate each customer's unique design and
lead-time requirements.
Choosing CTS as a supplier adds value by providing
expert technical assistance during the design stage, quick
prototype
turnaround
and
dedicated
manufacturing
throughout the application lifecycle. CTS thermal manage-
ment products are sold and supported through the CTS global
network of manufacturer representatives, distributors and
research facilities. We welcome the opportunity to serve you.
Please visit us at www.ctscorp.com/components and then
click on - Heat Sinks/Thermal Management Solutions and
Circuit Board Retainers.
CTS
HI-TEMP FAN HEAT SINKS - FHS-090 SERIES
High Operating Temperature Integrated Fan Heat Sinks
®
DESIGN FEATURES
■
Industry-leading maximum operating temperature of 90°C
■
Compatible with chipset footprints ranging from 21x21 mm to
45x45 mm
■
Total heights from 16.1 mm for low profile applications to 44.6
mm for lowest thermal resistance
■
Forged and extruded versions available
■
Choice of elliptical, round pin, and plate fin styles
DESCRIPTION
The FHS-090 Series of integrated-fan heat sinks is uniquely designed to absorb and disperse heat away from
high temperature devices while offering key features such as an operating temperature range of -10°C to 90°C,
calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to best fit the
application. Thermal resistance values range from 4.07°C/W to as low as 1.24°C/W.
These new fansinks can maintain superior thermal dissipation for devices that emit high amount of heat. CTS’
fansinks are available in a wide range of footprints and fin heights which make them suitable for many
elevated temperature applications such as component testing, burn-in, high density servers, high- speed
computing and video, and use in areas where the system airflow is constrained.
Elliptical Fins
Part Number
FHE35-35-27
FHE35-35-30
FHE35-35-33
FHE35-35-35
FHE35-35-40
FHE35-35-45
FHE40-40-24
FHE40-40-27
FHE40-40-30
FHE40-40-33
FHE40-40-35
FHE40-40-40
FHE40-40-45
FHE43-43-22
FHE43-43-25
FHE43-43-28
FHE43-43-31
FHE43-43-33
FHE43-43-38
FHE43-43-43
Length x Width x Height
(mm)
35 x 35 x 26.6
35 x 35 x 29.6
35 x 35 x 32.6
35 x 35 x 34.6
35 x 35 x 39.6
35 x 35 x 44.6
40 x 40 x 23.6
40 x 40 x 26.6
40 x 40 x 29.6
40 x 40 x 32.6
40 x 40 x 34.6
40 x 40 x 39.6
40 x 40 x 44.6
42.5 x 42.5 x 21.6
42.5 x 42.5 x 24.6
42.5 x 42.5 x 27.6
42.5 x 42.5 x 30.6
42.5 x 42.5 x 32.6
42.5 x 42.5 x 37.6
42.5 x 42.5 x 42.6
Thermal Resistance (R
TH
)
1.65
1.54
1.48
1.46
1.40
1.36
1.75
1.54
1.42
1.34
1.32
1.27
1.24
1.65
1.46
1.33
1.28
1.26
1.23
1.19
FHE40-40-xx
3
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