Technical Data Sheet
Thermstrate ® TC
November 2002
PRODUCT DESCRIPTION
Thermstrate® TC is a phase change thermal interface material
suitable for use between a heat sink and a variety of heat
dissipating components. This product is supplied as a dry
compound in bar form, packaged in a unique easy to use
applicator, which flows in the installation at the phase change
temperature and conforms to the surface features of the heat
sink and component. Upon flow, air is expelled from the
interface, reducing thermal impedance and the material
performs as a highly efficient thermal transfer medium.
Thermstrate TC is a convenient alternative to die cut preforms.
Custom parts of the equivalent preformed material,
Thermstrate 2000, are available upon request for a wide range
of applications
.
TYPICAL APPLICATIONS
Micro processors, hybrid power modules, solid state relays,
power transistors, power modules, IGBT’s, RF components
etc. Typically used between any heat dissipating electrically
isolated component and a heat sink or thermal solution.
MATERIAL PROPERTIES
One application of Thermstrate TC results in a compound
coating thickness of approximately 0.25 mils (0.00635mm).
Data for this coating thickness is provided below.
Units
Substrate
Compound
Thickness
(Nominal)
Thermal Impedance
@ 20psi ASTM
D5470
@137.8
KPa,
ASTM D5470
Thermal Impedance
@100psiASTM
D5470
@689.5
KPa,
ASTM D5470
Thermstrate
TC
.00025
.00635
PRODUCT PERFORMANCE
Thermal Impedance vs Mounting Pressure
The performance of any phase change thermal interface
material will be improved by increasing the mounting pressure
at the interface. The graph below shows the thermal
impedance values generated on an ASTM D5470 platform.
The test block dimensions are 2” x 2”, the finish is 64
microinches and the flatness is .002 inches/inch. The power
level is 80 watts.
L
PRODUCT CHARACTERISTICS
inches
mm
°C-in
2
/W
°C-
cm
2
/W
°C-in /W
°C-
cm
2
/W
2
.015
.097
.010
.065
PHYSICAL PROPERTIES
Part Number (Standard)
Phase change temperature
TC-175-125
60°C
The graph above shows the typical performance for
Thermstrate TC when placed between a device and a heat
sink, under a clamp load of 10psi. The temperature at the case
of the device and the heat sink are recorded. During the first
reflow cycle, i.e. prior to phase change, Thermstrate TC
exhibits relatively high thermal impedance. Once the material
has changed phase one time, all subsequent operations will
see the thermal impedance values indicated on the curve
traces which approximately parallel the horizontal axis.
Volumetric expansion upon phase 15%
change
Viscosity
above
phase
change Thixotropic
temperature
Color
Opaque White
No silicones in the compound formulation.
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT LOCTITE
CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.
TDS Thermstrate TC November 2002
Operating Temperature Range
Tests have confirmed that Thermstrate TC can be used reliably
up to 150°C.
Surface Conditions
Typical interface surface conditions are quoted below:
Surface finish
Surface flatness
64 microinches or
better
1.6 microns or better
.002 inches/inch or
better
.001 cm/cm or better
Storage
Prior to assembly products shall ideally be stored in a cool, dry
location in original packaging at temperatures below 40°C
(104°F). Under these conditions the shelf life is indefinite.
Thermstrate can be applied to heat sinks which are then
shipped to a final assembly location as long as the temperature
does not exceed that stated above.
Note
The data contained hereon are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user’s responsibility to
determine suitability for the user’s purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In the light of the foregoing,
Loctite Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from the sale or use of Loctite
Corporation’s products. Loctite Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind including lost profits.
The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from license
under any Loctite Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.
General Information
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
Thermstrate TC is completely reworkable. No foreign residue
remains after disassembly. If, due to the need for repair or
rework of the installation, a second application of the
Thermstrate TC can be made without the need for cleaning of
interface surfaces. If a clean surface is required, any residual
phase change compound present can be easily removed with
mineral spirits.
While Thermstrate TC is supplied as a convenient to use
applicator bar, pretooled pads are available for over one
thousand commonly used electronic devices. Thermstrate
2000 may be available as single die cut pads, on multi-pad
sheets, or on continuous rolls for high volume production
Application Recommendations
Reasonable flatness and surface conditions should apply to
both mating surfaces. Flatness specification for one mating
surface of 0.002 in/in is typical of a reasonable flatness and
finish specifications work well with this product.
These applicator bars are designed in a width that has been
highly successful as a low-cost application for microprocessor
heat sinks. They are typically used with one “swipe” to make a
very acceptable compound application of appropriate thickness
and consistency for typical microprocessor heat sinks.
Application of this material should be simple with little
requirement for repeated application on the same surface. No
dispensing or squeegeeing equipment is required.
The TC Applicator Bar can be used on an unlimited variety of
heat sinks, cold plates, or other component designs,
maximizing flexibility. They are intended to be used to deliver
a minimum coating thickness on any heat transfer device.
Complete directions for use are available via contact with
Loctite Laguna Hills, CA at (949) 582-6712.
Loctite Electronics
Henkel Loctite Corporation, 26941 Cabot Road, Bldg 124, Laguna Hills, CA 92653, U.S.A.
U.S.A.: 949.582.6712
Canada: 905.814.6511
Brazil: 011.55.11.4143.7000
Loctite is a Trademark of Henkel Loctite Corp. U.S.A.
www.loctite.com
Test/Measurement
京公网安备 11010802033920号
EEWORLD
