C1206X472K4RACAUTO datasheet, PDF

Datasheet> All Categories > Passive components> capacitor> C1206X472K4RACAUTO

C1206X472K4RACAUTO: DescriptionCeramic Capacitor, Ceramic,; CategoryPassive components capacitor; File Size730KB，23 Pages; ManufacturerKEMET; Websitehttp://www.kemet.com

Download Datasheet Parametric View All

C1206X472K4RACAUTO Overview

Ceramic Capacitor, Ceramic,

C1206X472K4RACAUTO Parametric

Parameter Name	Attribute value
Objectid	7036238035
package instruction	, 1206
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	7.48
capacitance	0.0047 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.78 mm
JESD-609 code	e3
length	3.3 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package form	SMT
method of packing	TR, EMBOSSED PLASTIC, 13 INCH
positive tolerance	10%
Rated (DC) voltage (URdc)	16 V
Guideline	AEC-Q200
size code	1206
surface mount	YES
Temperature characteristic code	X7R
Temperature Coefficient	15% ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	1.6 mm

Preview

Download Datasheet

View All

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP) X7R Dielectric,

6.3 – 250 VDC (Automotive Grade)

Overview

The KEMET Automotive Grade Flexible Termination (FT-CAP)

multilayer ceramic capacitor in X7R dielectric incorporates

a unique, flexible termination system that is integrated with

KEMET’s standard termination materials. A conductive silver

epoxy is utilized between the base metal and nickel barrier

layers of KEMET’s standard termination system in order

to establish pliability while maintaining terminal strength,

solderability and electrical performance. This technology

was developed in order to address the primary failure mode

of MLCCs – flex cracks, which are typically the result of

excessive tensile and shear stresses produced during board

flexure and thermal cycling. Flexible termination technology

inhibits the transfer of board stress to the rigid ceramic body,

therefore mitigating flex cracks which can result in low IR or

short circuit failures.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide

superior flex performance over standard termination

systems. FT-CAP complements KEMET’s Open Mode,

Floating Electrode (FE-CAP), Floating Electrode with Flexible

Termination (FF-CAP) and KEMET Power Solutions (KPS)

product lines by providing a complete portfolio of flex

mitigation solutions.

Combined with the stability of an X7R dielectric and designed

to accommodate all capacitance requirements, these flex-

robust devices are RoHS-compliant, offer up to 5 mm of

flex-bend capability and exhibit a predictable change in

capacitance with respect to time and voltage. Capacitance

change with reference to ambient temperature is limited to

±15% from −55°C to +125°C.

Whether underhood or in-cabin, these capacitors are designed

to provide reliable performance in a mission and safety of

critical automotive circuits. Stricter testing protocol and

inspection criteria have been established for automotive grade

products in recognition of potentially harsh environmental

conditions. KEMET automotive grade series capacitors meet

the demanding Automotive Electronics Council's AEC-Q200

qualification requirements.

Ordering Information

Ceramic

1206

106

Capacitance

Code (pF)

Two

significant

digits and

number of

zeros

Dielectric

R = X7R

Failure Rate/

Design

A = N/A

Termination

Finish

C = 100% Matte Sn

AUTO

Packaging/

Grade (C-Spec)

See

"Packaging

C-Spec

Ordering

Options

Table"

Case Size

Specification/

(L" x W")

Series

0603

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

termination

Capacitance

Rated Voltage

Tolerance

(VDC)

J = ±5%

K = ±10%

M = ±20%

9 = 6.3

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

2 = 200

A = 250

Additional termination finish options may be available. Contact KEMET for details.

Built Into Tomorrow

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1078_X7R_FT-CAP_AUTO_SMD • 1/20/2022

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), X7R Dielectric, 6.3 – 250 VDC (Automotive Grade)

Automotive C-Spec Information

KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive

Components. These products are supported by a Product Change Notification (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”

This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade

component without the requirement to submit a customer Source Controlled Drawing (SCD) or specification for review by a

KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are

not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited

(see details below.)

Product Change Notification (PCN)

The KEMET product change notification system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, fit, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

KEMET Automotive

C-Spec

KEMET assigned

AUTO

Customer Notification Due To:

Process/Product change

Yes (with approval and sign off)

Yes (without approval)

Obsolescence*

Yes

Days Prior To

Implementation

180 days minimum

90 days minimum

KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design records and specification requirements are properly

understood and fulfilled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

KEMET Automotive

C-Spec

KEMET assigned

AUTO

PPAP (Product Part Approval Process) Level

●

○

●

KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.

●

Part number specific PPAP available

○

Product family PPAP only

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

C1078_X7R_FT-CAP_AUTO_SMD • 1/20/2022

Recommended Resources

Semiconductor self-excited excitation circuit

SCA broadcast receiver

Interface circuit in offset detection circuit

4-bit direct drive LCD circuit

Audio Notch Filter

Computer motherboard circuit diagram 810 4_17

High efficiency, high precision, low EMI, primary feedback LED constant current driver chip without auxiliary winding: LP3101/LP3106/LP3107 is a high efficiency, low EMI primary side feedback LED constant current driver. It is suitable for flyback LED constant current power supply with input voltage range of AC85V-264...; jimmyliu188 Power technology

SMT machine full source code control board circuit diagram and computer software host computer source code (with visual recognition): [align=left][font=Tahoma,][color=#404040][font=tahoma, arial, 宋体, sans-serif]Due to the trouble of the mechanical part, I will sell the [/font][/color][/font][/align][align=left][font=Tahoma,][color=#...; net2uizoo DIY/Open Source Hardware

【LPC54100】Getting started with the environment, registration is fun: [i=s]This post was last edited by ljj3166 on 2015-2-18 01:13[/i] I used NXP's stuff a long time ago, but it was under the MDK environment. This time I decided to use NXP's own compilation environment ...; ljj3166 NXP MCU

Please advise: where can I download the TCP-based network printing protocol: Please tell me where I can download the TCP-based network printing protocol. I am planning to develop network printing functions in an embedded system, and I only found IPP and Internet printing intro...; qddianzi Embedded System

Release the schematic diagram of the STM32F417/407 development board we made: The board is the NSSTM32F4-R1 development board that I recently made. The schematic diagram has been converted into pdf format and uploaded for sharing....; bluehacker stm32/stm8

Part 4 - How to use Thinker Board's FT232 high-speed USB interface programming: The common high-speed USB interface currently uses the CY68013 solution of CYPRESS, but the chip programming is relatively complicated. Reference: [url]http://www.amobbs.com/thread-5510241-1-1.html[/u...; sblpp DIY/Open Source Hardware

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components