V-1100-SMD/A-L datasheet, PDF - EEWORLD Datasheet

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V-1100-SMD/A-L: Descriptionheatsink TO-263 12.70x26.20mm; CategoryThermal management products; File Size160KB，1 Pages; ManufacturerASSMANN WSW components; Environmental Compliance

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V-1100-SMD/A-L Overview

heatsink TO-263 12.70x26.20mm

V-1100-SMD/A-L Parametric

Parameter Name	Attribute value
Datasheets
V-1100-SMD/A(-L) Drawing
Product Photos
V-1100-SMD/A-L
Product Training Modules
WSW Components Line of Board-Level Transistor Heat Sink Overview
Standard Package	500
Category	Fans, Thermal Manageme
Family	Thermal - Heat Sinks
Type	Top Mou
Package Cooled	TO-263
Attachment Method	SMD Pad
Shape	Rectangul
Length	0.500" (12.70mm)
Width	1.031" (26.20mm)
Diamete	-
Height Off Base (Height of Fin)	0.390" (9.91mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	23°C/W
Material	Coppe
Material Finish	Ti
Dynamic Catalog	Heat Sink
Other Names	A10760V1100SMDAL

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1

4

A

2

3

5

6

7

A

B

C

D

3

8

4

D

7

3

Tape & Reel

1Reel = 300PCS

A

44,0

B

40,40

C

D

Toleranes: unless otherwise

specificied ±0,3

24,0

4,0

E

3

Material: Coper, 06mm thick

Finished: Tin plated

E

Option

Packing

7

Thermal resistance (K/W)

F

8

add PCB soldering layout footprint

7

6

5

4

Update the packing quantities

Change production plant

Modify drawing layout

change dimension

3

Id.

Update

Modification

10.04.2014

23.09.2013

10.03.2010

27.07.09

14.05.09

19.06.02

Date

Andy

Amy

Alex

N.Schulz

Name

Drawn

Approved

-

L

Tape reel

300pcs/reel

Bulk

500pcs/PE bag

Date

19.06.02

17.12.2013

23

F

23

RoHS compliant

Name

Customer-No.

G

Unit: mm

Hellwig

G

Amy

ASSMANN WSW-No.

V-1100-SMD/A x

Drawing-No.

H

1

2

ASS 0518 HS

3

4

5

rev08

H

Replace

Sheet

6

7

V-1100-SMD/A-L Related Products

	V-1100-SMD/A-L	V-1100-SMD/A
Description	heatsink TO-263 12.70x26.20mm	heatsink TO-263 12.70x26.20mm
Standard Package	500	1
Category	Fans, Thermal Manageme	Fans, Thermal Manageme
Family	Thermal - Heat Sinks	Thermal - Heat Sinks
Type	Top Mou	Top Mou
Package Cooled	TO-263	TO-263
Attachment Method	SMD Pad	SMD Pad
Shape	Rectangul	Rectangul
Length	0.500" (12.70mm)	0.500" (12.70mm)
Width	1.031" (26.20mm)	1.031" (26.20mm)
Height Off Base (Height of Fin)	0.390" (9.91mm)	0.390" (9.91mm)
Thermal Resistance @ Natural	23°C/W	23°C/W
Material	Coppe	Coppe
Material Finish	Ti	Ti
Dynamic Catalog	Heat Sink	Heat Sink
Other Names	A10760V1100SMDAL	A10752DKR

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