TXBF-019-025B datasheet, PDF - EEWORLD Datasheet

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TXBF-019-025B: Descriptionthermal link presson TO-18; CategoryThermal management products; File Size137KB，2 Pages; ManufacturerCTS [CTS Corporation]

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TXBF-019-025B Overview

thermal link presson TO-18

TXBF-019-025B Parametric

Parameter Name	Attribute value
Datasheets
Heatsinks, Thermal Links
Product Photos
TXBF-019-025B Heat Sink
Catalog Drawings
TXBF Series
Standard Package	250
Category	Fans, Thermal Manageme
Family	Thermal - Heat Sinks
Type	Top Mou
Package Cooled	TO-18
Attachment Method	Press Fi
Shape	Cylindrical
Length	-
Width	-
Diamete	0.500" (12.70mm) OD
Height Off Base (Height of Fin)	0.250" (6.35mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	150°C/W
Material	Beryllium Coppe
Material Finish	Black Cadmium
Other Names	294-1004

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CTS

iZIF

™

HEAT FRAME

GENERAL DESCRIPTION

The iZIF

™

is a custom aluminum heat frame that integrates

the PCB retainer for improved structural integrity and thermal

efficiency (.8°C-in./W). The iZIF

™

is a highly reliable patent-

pending design for rugged military and aerospace circuit card

applications. It features a quarter-turn lock, uniform clamping

pressure, and can be sized to fit small daughter cards up to

9U VME. A bottom plate may also be added for additional

cooling and structural integrity. The iZIF

™

features a 1/8”

stainless steel socket head cap rod with beryllium copper

spring. A variety of finishes are available such as chemical

film, black anodize, and electroless nickel.

THERMAL LINKS

GENERAL DESCRIPTION

CTS’s thermal links provide superior retention because

of the 6 to 8-segment fingers versus the 2 or 3-segment

fingers available from other manufacturers. These thermal

links are offered for TO-5s, TO-8s and TO-18s with or

without BeO washer and other appropriate hardware.

They provide an effective retainer and efficient thermal

path between semiconductor and heat sinks or chassis.

There is excellent transistor retention under high

vibration and shock loads. The thermal links can be

inserted and removed multiple times without loss of

retention or damage to the finish over the entire JEDEC

case diameter range. They can be installed with a rivet or

eyelet, soldered to a PC pad or heat sink, mounted with a

single screw or with a threaded stud and hex nut.

FAN TOP SERIES

Fan Tops

“A”

Dim.

.25

.36

.33

.12

“B” Semiconductor

Dim.

Case Type

*Ø °C/W

.50

.75

1.25

TO-18

TO-5

TO-8

TO-5

TO-8

150.0

81.1

57.7

41.0

56.6

Unplated

Part Number

Black Cadmium

Black Chem.

Material

BeCu

Brass

BeCu

Brass

Brass Fan

BeCu Retainer

Brass Fan

BeCu Retainer

Brass

TXBF-019-025U TXBF-019-025B

N.A.

TXCF-019-025U

N.A.

TXCF-019-025CB

TXBF-032-025U TXBF-032-025B

N.A.

TXCF-032-025U

N.A.

TXCF-032-025CB

TXBF2-032-036U TXBF2-032-036B

N.A.

TXBF2-050-033U TXBF2-050-033B

TXCF-125-1U

TXCF-125-2U

TXCF-125-1CB

TXCF-125-2B

N.A.

*Natural convection, case-ambient mounted on G10 board

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