EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-21B-26-C3-R0

Description
heatsink 70x70x10mm xcut t412
CategoryThermal management products   
File Size417KB,1 Pages
ManufacturerSeek Thermal
Websitehttps://www.thermal.com/
Environmental Compliance  
Download Datasheet Parametric View All

ATS-21B-26-C3-R0 Overview

heatsink 70x70x10mm xcut t412

ATS-21B-26-C3-R0 Parametric

Parameter NameAttribute value
Datasheets
ATS-21B-26-C3-R0
Standard Package1
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeTop Mou
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodPush Pi
ShapeSquare, Fins
Length2.756" (70.00mm)
Width2.756" (70.00mm)
Diamete-
Height Off Base (Height of Fin)0.394" (10.00mm)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow14.24°C/W @ 100 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlue Anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-21B-26-C3-R0
Description:
pushPIN™ HS ASMBLY,FINE-PITCH,XCUT, HOLE PATTERN:4-CORNER,BLUE,T412
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-FPX070070010-26-C3-R0
Push Pin:
Springs:
ATS-PP-02
ATS-PPS-21
Qty
1
2
2
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
14.24
2.06
200
(1.0)
6.99
1.22
300
(1.5)
3.88
0.96
400
(2.0)
2.56
0.83
500
(2.5)
1.91
0.75
600
(3.0)
1.54
0.69
700
(3.5)
1.31
Fin
Pitch
FINE-PITCH
Fin
Type
XCUT
Hole
Pattern
4-CORNER
0.65
Product Detail
P/N
ATS-21B-26-C3-R0
A
70.00
Dimensions
B
C
E
70.00
10.00
63.00
F
63.00
NOTES:
Push Pin
ATS-PP-02
Spring
ATS-PPS-21
TIM
T412
Finish
BLUE ANODIZED
For Illustration Purposes ONLY.
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction
of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice
to improve the design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
How to use 51 single chip microcomputer to control the speed and start and stop of stepper motor
The 51 single-chip microcomputer is used to control the start, stop and speed of the stepper motor. This is the design topic I chose, but I don’t understand the function of the uln2003a used. The key ...
飞翔的秋 51mcu
i.MX6ULL Embedded Linux Development——by DDZZ669
@DDZZ669i.MX6ULL Embedded Linux Development 1-Preliminary Study on Uboot Transplantation i.MX6ULL Embedded Linux Development 2-uboot Porting Practice i.MX6ULL Embedded Linux Development 3-Kernel Porti...
okhxyyo ARM Technology
Is there a graduation project report on an electronic coin piggy bank?
Do you have a graduation project report on an electronic coin piggy bank? If so, please send it to me. My email address is [email]11970268@qq.com[/email], thank you!...
jiabao1125 MCU
The three-phase high current (30A~40A) of the motor is connected through the PCB, and the heat dissipation hole blind hole problem
Make a four-layer board with 2oz. Because the board shape is fixed, U, V, W and the center line are each one layer. The narrowest line width is 6.8mm. Due to heat dissipation issues, the four layers a...
FantasyTG PCB Design
Keil's support for TI is not very good
Recently, Keil 5.0 was released, and TI's M4 with Ethernet was also released. Keil has changed a lot, but there is no TI chip in the Device List yet. I don't know how long I have to wait!...
miniko Microcontroller MCU
Chapter 16 Database Library
16.1 Introduction 386 16.2 History 386 16.3 Library 386 16.4 Implementation Overview 388 16.5 Centralized or Decentralized 390 16.6 Concurrency 391 16.6.1 Coarse-grained Locking 391 16.6.2 Fine-graine...
謃塰 Linux and Android

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2742  769  1590  1765  1006  56  16  32  36  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号