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831502B03900

Description
heatsink stamp 19x12.8x12.7mm
CategoryThermal management products   
File Size330KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance  
Download Datasheet Parametric View All

831502B03900 Overview

heatsink stamp 19x12.8x12.7mm

831502B03900 Parametric

Parameter NameAttribute value
Datasheets
831502B03900
Fans, Blowers, Impellers Catalog
Product Photos
831502B03900
Catalog Drawings
83(1,3)(5,3)02B0 Series
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level, Vertical
Package CooledTO-220, TO-262
Attachment MethodClip and PC Pi
ShapeRectangular, Fins
Length0.750" (19.05mm)
Width0.504" (12.80mm)
Diamete-
Height Off Base (Height of Fin)0.500" (12.70mm)
Power Dissipation @ Temperature Rise1W @ 30°C
Thermal Resistance @ Forced Air Flow7.0°C/W @ 400 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
Other Names831502B03900-NDCR468
Board Level
Heat Sinks
P/N: 831502B03900
TO-220,
TO-262
PRODUCT SPECIFICATIONS
• Devices: TO-220 & TO-262
• Size: 19.0 x 12.8 x 12.7 mm
• Material: Aluminum, 1.2 mm Thick
• Type: Stamped
• IC Mounting: Integrated Spring
• PCB Mounting: Solderable Tab
• Finish: Black Anodized
• Package: Bulk
Air Velocity - LFM
0
100
Temp Rise Above Ambient -
0
C
(Mounting Surface)
200
400
600
800
1000
10
8
6
4
2
0
Thermal Resistance -
0
C / Watt
(Mounting Surface to Ambient)
80
60
40
20
0
0
1
2
3
4
5
Heat Dissapated - Watts
FEATURES & BENEFITS
• No Hardware Device Attachment
• Constant Spring Force Tension
• Vertical Mounting via Solderable Tab
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
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