Board Level
Heat Sinks
P/N: 832700T00000 & 8327TRT00000
D2 PAK, TO-263
PRODUCT SPECIFICATIONS
Air Velocity - LFM
Temp Rise Above Ambient -
o
C
(Mounting Surface)
40
30
20
10
0
0
0.5
1
1.5
2
2.5
Heat Dissipated - Watts
16
12
8
4
0
FEATURES & BENEFITS
•
No Hardware Device Attachment
• Direct SMT Contact to PCB
• Solderable Legs
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Body Configurations
• Contact Applications Engineering
Part Number
832700T00000
8327TRT00000
Packaging
Bulk
Tape & Reel
Notes
Contact Factory for Tape and Reel Specs
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
Thermal Resistance -
o
C/ Watt
(Mounting Surface to Ambient)
• Devices: D2 PAK, TO-263
• Size: 26.2 x 12.7 x 9.9 mm
• Copper, 0.6 mm Thick
• Type: Stamped
• PCB Mounting: Surface Mount Technology
• Finish: Tin Plate
• Package: Bulk or Tape & Reel
0
50
200
400
600
800
1000
20