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833802T00000

Description
heatsink stamp 13.1x13.2x24mm
CategoryThermal management products   
File Size397KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance  
Download Datasheet Parametric View All

833802T00000 Overview

heatsink stamp 13.1x13.2x24mm

833802T00000 Parametric

Parameter NameAttribute value
Datasheets
833802T00000
Fans, Blowers, Impellers Catalog
Product Photos
833802T00000
Catalog Drawings
833802T00000
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level, Vertical
Package CooledTO-220
Attachment MethodClip and PC Pi
ShapeRectangul
Length0.848" (21.55mm)
Width0.520" (13.21mm)
Diamete-
Height Off Base (Height of Fin)0.515" (13.08mm)
Power Dissipation @ Temperature Rise0.5W @ 20°C
Thermal Resistance @ Forced Air Flow12°C/W @ 500 LFM
Thermal Resistance @ Natural-
MaterialCoppe
Material FinishTi
Other Names833802T00000-NDCR491
Board Level
Heat Sinks
P/N: 833802T00000
TO-220
PRODUCT SPECIFICATIONS
———
• Devices: TO-220
• Size: 13.1 x 13.2 x 24.0MM
• Material: Copper, 0.6MM Thick
• Type: Stamped
• Finish: Tin Plate
IC Mounting: Integrated Spring
• PCB Mounting: Solderable Device Leads
• Package: Bulk
Air Velocity - LFM
0
Temp Rise Above Ambient -
o
C
100
(Mounting Surface)
80
60
40
20
0
0
1
2
3
4
5
Heat Dissipated - Watts
200
400
600
800
1000
20
16
12
8
4
0
(Mounting Surface to Ambient)
Thermal Resistance -
o
C/ Watt
FEATURES & BENEFITS
—————
No Hardware Device Attachment
Constant Spring Force Tension
• RoHS Compliant
CUSTOMIZED HEAT SINKS
————
Specialized Tabs, Plating
Specialized Body Configurations
Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
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