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833900T00000

Description
heatsink stamp 25.9x15x9.5mm
CategoryThermal management products   
File Size391KB,1 Pages
ManufacturerComair Rotron
Environmental Compliance  
Download Datasheet Parametric Compare View All

833900T00000 Overview

heatsink stamp 25.9x15x9.5mm

833900T00000 Parametric

Parameter NameAttribute value
Datasheets
833900T00000
Fans, Blowers, Impellers Catalog
Catalog Drawings
833900T00000
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level
Package CooledD²Pak, PowerSO-10
Attachment MethodSMD Pad
ShapeRectangular, Fins
Length0.590" (14.99mm)
Width1.020" (25.91mm)
Diamete-
Height Off Base (Height of Fin)0.375" (9.52mm)
Power Dissipation @ Temperature Rise2W @ 40°C
Thermal Resistance @ Forced Air Flow5°C/W @ 400 LFM
Thermal Resistance @ Natural-
MaterialCoppe
Material FinishTi
Other Names833900T00000-NDCR504
Board Level
Heat Sinks
P/N: 833900T00000 & 8339TRT00000
D PAK, TO-263,
SO-10,
MO-184
PRODUCT SPECIFICATIONS
• Devices: D PAK, TO-263, SO-10, MO-184
• Size: 25.9 x 15.0 x 9.5 mm
• Material: Copper, 0.6 mm Thick
• Type: Stamped
• PCB Mounting: Surface Mount Technology
• Finish: Tin Plate
• Package: Bulk or Tape & Reel
Air Velocity - LFM
0
o
200
400
600
800
1000
Thermal Resistance -
o
C/ Watt
(Mounting Surface to Ambient)
10
8
6
4
2
0
100
80
60
40
20
0
0
1
2
3
4
5
Heat Dissipated - Watts
FEATURES & BENEFITS
No Hardware Device Attachment
• Direct SMT Contact to PCB
• Solderable Legs
• RoHS Compliant
CUSTOMIZED HEATSINKS
• Specialized Tabs, Plating
• Specialized Body Configurations
• Contact Applications Engineering
Part Number
833900T00000
8339TRT00000
Packaging
Bulk
Tape & Reel
Notes
Contact Factory for Tape and Reel Specs
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
Temp Rise Above Ambient -
(Mounting Surface)
C

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833900T00000 8339TRT00000
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