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Datasheet> All Categories > Thermal management products> 833302B02800
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833302B02800

Description
heatsink stamp 19x12.7x12.7mm
CategoryThermal management products   
File Size351KB，1 Pages
ManufacturerComair Rotron
Environmental Compliance  
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833302B02800 Overview

heatsink stamp 19x12.7x12.7mm

833302B02800 Parametric

Parameter NameAttribute value
Datasheets
833302B02800
Fans, Blowers, Impellers Catalog
Product Photos
833302b02800
Catalog Drawings
83(1,3)(5,3)02B0 Series
Standard Package50
CategoryFans, Thermal Manageme
FamilyThermal - Heat Sinks
TypeBoard Level, Vertical
Package CooledTO-220, TO-262
Attachment MethodClip and PC Pi
ShapeRectangular, Fins
Length0.750" (19.05mm)
Width0.500" (12.70mm)
Diamete-
Height Off Base (Height of Fin)0.500" (12.70mm)
Power Dissipation @ Temperature Rise1W @ 40°C
Thermal Resistance @ Forced Air Flow16.0°C/W @ 200 LFM
Thermal Resistance @ Natural-
MaterialAluminum
Material FinishBlack Anodized
Other Names833302B02800-NDCR501

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Board Level
Heat Sinks
P/N: 833302B02800
TO-220,
TO-262
PRODUCT SPECIFICATIONS
• Devices: TO-220 & TO-262
• Size: 19.0 x 12.7 x 12.7 mm
• Material: Aluminum, 0.8 mm thick
• Type: Stamped
• Finish: Black Anodized
• PCB Mounting: Solderable Spring Tab
• IC Mounting: Integrated Spring
•
Package: Bulk
Air Velocity - LFM
0
Temp Rise Above Ambient -
o
C
(Mounting Surface)
100
80
60
40
20
0
0
1
2
3
4
5
Heat Dissipated - Watts
200
400
600
800
1000
Thermal Resistance -
o
C / Watt
(Mounting Surface to Ambient)
20
16
12
8
4
0
FEATURES & BENEFITS
• No Hardware Device Attachment
• Constant Spring Force Tension
• Vertical Mounting via Solderable Tab
• RoHS Compliant
CUSTOMIZED HEATSINKS
•
Specialized Tabs, Plating
•
Specialized Body Configurations
• Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com

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