Gap Pad 1500
®
Thermally Conductive, Un-Reinforced Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Un-reinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating
PROPERTY
Color
Reinforcement Carrier
Thickness (inch) / (mm)
Inherent Surface Tack (1 sided)
Density (Bulk Rubber) (g/cc)
Heat Capacity (J/g-K)
Hardness (Bulk Rubber) (Shore 00) (1)
Young's Modulus (psi) / (kPa) (2)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
TYPICAL PROPERTIES OF GAP PAD 1500
IMPERIAL VALUE
Black
—
0.020 to 0.200
2
2.1
1.0
40
45
-76 to 392
>6000
5.5
10
11
METRIC VALUE
Black
—
0.508 to 5.080
2
2.1
1.0
40
310
-60 to 200
>6000
5.5
10
11
TEST METHOD
Visual
—
ASTM D374
—
ASTM D792
ASTM E1269
ASTM D2240
ASTM D575
—
ASTM D149
ASTM D150
ASTM D257
U.L. 94
ASTM D5470
V-O
1.5
V-O
1.5
10
1.62
Gap Pad 1500 has an ideal filler blend that
gives it a low-modulus characteristic that
maintains optimal thermal performance yet
still allows for easy handling.The natural tack
on both sides of the material allows for
good compliance to adjacent surfaces of
components, minimizing interfacial resistance.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thickness vs. Thermal Resistance
Gap Pad 1500
Resultant Thickness (mils)
THERMAL PERFORMANCE vs. STRAIN
Deflection (% strain)
Thermal Impedance (°C-in
2
/W) 0.040" (3)
20
1.50
30
1.33
1) Thir ty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch
2
. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the sur-
face roughness, flatness and pressure applied.
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• RDRAM™ memory modules / chip scale packages
• Areas where heat needs to be transferred to a frame chassis or other type of heat spreader
200
150
100
50
0
0
1
2
3
4
5
2
Thermal Resistance (C-in /W)
6
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number
GP1500
–
0.100
– 02
– 0816 –
NA
Standard Options
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
02 = Natural tack, both sides
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200"
GP1500 = Gap Pad 1500 Material
Section A
Section B
Section C
Note: To build a part number, visit our website at www.bergquistcompany.com.
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company -
Asia Headquarters
Hong Kong
Phone: 852-2690-9296
Fax: 852-2690-2344
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_GP_1500_0711
Section D
FPGA/CPLD
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