HY23V64200S-100 datasheet, PDF

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HY23V64200S-100: DescriptionMASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44; Categorystorage storage; File Size106KB，7 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY23V64200S-100 Overview

MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44

HY23V64200S-100 Parametric

Parameter Name	Attribute value
Maker	SK Hynix
Parts packaging code	SOIC
package instruction	0.500 INCH, PLASTIC, SOP-44
Contacts	44
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	100 ns
Spare memory width	8
JESD-30 code	R-PDSO-G44
length	28.5 mm
memory density	67108864 bit
Memory IC Type	MASK ROM
memory width	16
Number of functions	1
Number of terminals	44
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	3.2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	12.6 mm
Base Number Matches	1

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HY23V64200

Description

preliminary

4MX16/8MX8 BIT

CMOS MASK ROM

The HY23V64200 high per formance read onl y m em or y i s or gani z ed ei th er a s 8,38 8,608 x 8bi t

(byte mode) or as 4,194,304 x16 bit(word mode) and has an access time of 100/120ns. It needs no external

control clock to assure simple operation, because of its asynchronous operation. It is designed to be suitable for

use in program memory of game machine, data memory and entertainments. The HY23V64200 is packaged in

a 44SOP, 44TSOP-II or 48TSOP-I provides polarity programmable CE and OE buffer as user option mode.

Key features

• Switchable Organization

Byte Mode : 8,388,608 X 8 bit

Word Mode : 4,194,304 X 16 bit

• Single 3.3V power supply operation

• Access Time : 100/120ns (Max)

• Standby Current : 50uA(Max)

• Operating Current : 35mA(Max)

• TTL compatible inputs and outputs

• 3-State outputs for wired-OR expansion

• Programmable CE or OE pin

• Word or Byte switchable by BHE pin

• Fully static operation

• High reliability

• Package

HY23V64200M : 48pin Plastic TSOP-I(12x20mm)

HY23V64200F : 48pin Plastic TSOP-I(12x20mm)

HY23V64200T : 44pin Plastic TSOP-II(400mil)

HY23V64200S : 44pin Plastic SOP(500mil)

Pin Description

A0~A21

Q0~Q14

Q15/A-1

BHE

CE/CE

OE/OE

VCC

VSS

Function

Address Inputs

Data Outputs

Output Q15(Word Mode)

LSB Address(Byte Mode)

Word/Byte Selection

Chip Enable Input

Output Enable Input

Power Supply(+3.3V)

Ground

No Connection

Pin Configuration

BHE

A16

A15

A14

A13

A12

A11

A10

A19

A21

A20

A18

A17

CEB

* User selectable polarity

• CEB : CE/CEB , OEB : OE/OEB

VSS

Q15/A-1

Q14

Q13

Q12

VCC

Q11

Q10

OEB

VSS

A15

A14

A13

A12

A11

A10

A19

A20

A21

A18

A17

48TSOP-I

(ROM TYPE)

48TSOP-I

(FLASH TYPE)

A16

BHE

VSS

Q15/A-1

Q14

Q13

Q12

VCC

Q11

Q10

OEB

VSS

CEB

HY23V64200M

Rev0 Page 1 of 7

HY23V64200F

HY23V64200S-100 Related Products

	HY23V64200S-100	HY23V64200T-120	HY23V64200M-100	HY23V64200F-120	HY23V64200F-100	HY23V64200T-100	HY23V64200M-120	HY23V64200S-120
Description	MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44	MASK ROM, 4MX16, 120ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 4MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 4MX16, 100ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 4MX16, 100ns, CMOS, PDSO44, 0.400 INCH, PLASTIC, TSOP2-44	MASK ROM, 4MX16, 120ns, CMOS, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48	MASK ROM, 4MX16, 120ns, CMOS, PDSO44, 0.500 INCH, PLASTIC, SOP-44
Maker	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix	SK Hynix
Parts packaging code	SOIC	TSOP2	TSOP1	TSOP1	TSOP1	TSOP2	TSOP1	SOIC
package instruction	0.500 INCH, PLASTIC, SOP-44	TSOP2,	TSOP1,	TSOP1,	TSOP1,	0.400 INCH, PLASTIC, TSOP2-44	TSOP1,	SOP,
Contacts	44	44	48	48	48	44	48	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	100 ns	120 ns	100 ns	120 ns	100 ns	100 ns	120 ns	120 ns
Spare memory width	8	8	8	8	8	8	8	8
JESD-30 code	R-PDSO-G44	R-PDSO-G44	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G44	R-PDSO-G48	R-PDSO-G44
length	28.5 mm	18.41 mm	18.4 mm	18.4 mm	18.4 mm	18.41 mm	18.4 mm	28.5 mm
memory density	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	44	44	48	48	48	44	48	44
word count	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
character code	4000000	4000000	4000000	4000000	4000000	4000000	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16	4MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	TSOP2	TSOP1	TSOP1	TSOP1	TSOP2	TSOP1	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	3.2 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	1.27 mm	0.8 mm	0.5 mm	0.5 mm	0.5 mm	0.8 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	12.6 mm	10.16 mm	12 mm	12 mm	12 mm	10.16 mm	12 mm	12.6 mm
Base Number Matches	1	1	1	1	1	1	1	1
JESD-609 code	-	e6	e6	e6	e6	e6	e6	-
Terminal surface	-	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	TIN BISMUTH	-

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